Adhesive film for encapsulating electronic element

Abstract

The invention discloses an adhesive film for encapsulating an electronic element. The adhesive film consists of the following components in parts by mass: 35-55 parts of organic silicon resin, 15-25 parts of acrylic resin, 12-18 parts of inorganic filler, 4-9 parts of titanium oxide, 3-7 parts of polyethylene wax and 5-9 parts of functional aid, wherein the functional aid comprises a dispersing agent, a curing agent and a film forming aid. The adhesive film for encapsulating the electronic element provided in the technical scheme of the invention can form a layer of protective film around the electronic element, so that chemical or physical damages of the external environment to the electronic element are reduced greatly. Moreover, the adhesive film is stable in property, is prevented from falling off easily, and does not damage the electronic element.

Description

technical field [0001] The invention relates to an adhesive film, in particular to an adhesive film for packaging electronic components. Background technique [0002] Electronic components are important parts that constitute electronic equipment or electromechanical equipment, and are relatively small and scattered. Improper packaging often causes electronic components to be affected by environmental factors, resulting in oxidation, deformation or other damage, which affects the function of electronic components and even brings harm to the entire device. Therefore, the storage of electronic components is very important. In the prior art, the materials used to package electronic components are generally sealed silicone rubber or other casings. Although they can reduce the hazards caused by the surrounding environment to a certain extent, the effect is still limited, and the structure is unreasonable, resulting in Electronic components create mechanical friction inside the pr...

AI Technical Summary

Problems solved by technology

Improper packaging often causes electronic components to be affected by environmental factors, resulting in oxidation, deformation or other damage, which affects the function of electronic components and even brings harm to the entire device. Therefore, the storage of electronic components is very important

In the prior art, the materials used to package electronic components are generally sealed silicone rubber or other casings. Although they can reduce the hazards caused by the surrounding environment to a certain extent, the effect is still limited, and the structure is unreasonable, resulting in Electronic components generate mechanical friction inside the protective housing, causing unnecessary damage