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Curable resin composition, cured coating film, and printed circuit board

A technology of curable resin and composition, applied in the directions of printed circuit parts, circuit substrate materials, instruments, etc., can solve the problems of reducing the hiding power of conductor circuit patterns, and achieve the effect of suppressing the reduction of reflectivity

Active Publication Date: 2017-04-12
TAIYO HLDG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, even if the coloring pigment proposed in Patent Document 1 is mixed, due to the heat history when the solder resist composition is applied to a printed circuit board and cured, the solder resist film is discolored to yellowish brown, and there is a problem with the conductor circuit pattern. Cases of reduced hiding power
[0006] In addition, in the white curable resin composition containing phthalocyanine of Patent Document 2, although phthalocyanine is blended from the case of a pigment with low discoloration due to thermal history, the yellowing of the resin component due to thermal history The color of the solder resist film is changed to yellowish brown, and the hiding power of the conductor circuit pattern may be reduced.

Method used

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  • Curable resin composition, cured coating film, and printed circuit board
  • Curable resin composition, cured coating film, and printed circuit board
  • Curable resin composition, cured coating film, and printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～18 and comparative example 1～3

[0145] Preparation of Curable Resin Composition

[0146] The various components shown in the following Table 1 and Table 2 and the ratios (parts by mass) shown in Tables 1 and 2 were blended, pre-mixed with a mixer, and then kneaded with a 3-roll mill. A curable resin composition is prepared.

[0147]

[0148]

[0149] The materials used in the detailed aforementioned Table 1 are as follows.

[0150] Carboxyl resin

[0151] CYCLOMER P (ACA) Z-250 (product name): manufactured by DAICEL CHEMICAL INDUSTRIES, LTD.

[0152] R-2000 (product name): It is made by DIC CORPORATION.

[0153] photopolymerization initiator

[0154] IRGACURE907 (product name): It is made by BASF JAPAN LTD.

[0155] KAYAKURE DETX-S (product name): manufactured by Nippon Kayaku Co., Ltd.

[0156] Darocur1173 (product name): manufactured by BASF JAPAN LTD.

[0157] reactive diluent

[0158] DPHA (product name): manufactured by Nippon Kayaku Co., Ltd.

[0159] DPM (product name): manufactur...

Embodiment 1～14 and comparative example 1～3

[0182] Each thermosetting resin composition of Examples 1-14 and Comparative Examples 1-3 containing a blue inorganic pigment was printed by screen printing on the FR-4 substrate on which the circuit was formed so that the dry coating film became about 20 μm, Pre-drying was performed at 80° C. for 30 minutes in a BOX furnace. After pre-drying, a 700mJ / cm 2 exposure, and then developed with 30°C, 1% sodium carbonate aqueous solution. After the development, post-curing was performed at 150° C. for 60 minutes in a BOX furnace to produce a substrate for a characteristic test.

Embodiment 15、16

[0184] The thermosetting resin compositions of Examples 15 and 16 were printed by screen printing so that the dry coating film was about 20 μm on the FR-4 substrate on which the circuit was formed, and then heated at 150° C. for 60 minutes in a BOX furnace. After curing, a substrate for characteristic testing is produced.

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Abstract

The invention provides a curing resin composition, a cured film, and a printed circuit board, and specifically, provided is the curing resin composition of a film which has excellent covering capacity and high reflection ratio, and restrains reduction of the reflection ratio caused by heat process, and especially provides a curing resin composition used for solder resist forming, the cured film obtained by the composition, and the printed circuit board. The curing resin composition is characterized by comprising organic binder bond and titanium oxide, and blue inorganic colorant.

Description

technical field [0001] The present invention relates to a curable resin composition suitable as an insulating layer of a printed circuit board on which a light-emitting element such as an LED is mounted, particularly a curable resin composition for forming a solder resist, a cured coating film obtained from the composition, and a curable resin composition having The cured coated film of the printed circuit board. Background technique [0002] In recent years, in printed circuit boards, applications such as backlights of liquid crystal displays such as portable terminals, personal computers, and televisions, and light sources of lighting fixtures, such as light-emitting diodes (LEDs) that emit light at low power, have been directly mounted and used. . [0003] For the solder resist film (insulating film) formed as a protective film coating on the printed circuit board, in addition to the characteristics such as solvent resistance, hardness, soldering heat resistance, and ele...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/004G03F7/032H05K1/02
CPCC08K3/22C08K3/34C08L101/08G03F7/004G03F7/0046G03F7/0047H05K1/03
Inventor 山本修一中岛孝典横山裕椎名桃子
Owner TAIYO HLDG CO LTD