Micromechanical clamped beam type four-state reconfigurable microwave band-pass filter and preparation method

Abstract

The invention relates to a micromechanical clamped beam type four-state reconfigurable microwave band-pass filter. A CPW (1) horizontally arranged, a planar spiral inductor (2), a first MIM capacitor (3), a second MIM capacitor (4), a third MIM capacitor (5), a fourth MIM capacitor (6), a fifth MIM capacitor (7), a sixth MIM capacitor (8), a seventh MIM capacitor (9), an eighth MIM capacitor (10), a first MEMS clamped beam (14) and a second MEMS clamped beam (15), wherein the first MIM capacitor (3) and the second MIM capacitor (4) are connected between a CPW signal line and a ground wire in parallel, the third MIM capacitor (5) and the fourth MIM capacitor (6) are connected to the CPW signal line in series, and the fifth MIM capacitor (7), the sixth MIM capacitor (8), the seventh MIM capacitor (9) and the eighth MIM capacitor (10) are connected through leads. When the MEMS clamped beams make contact with salient points (13) of the two leads (12) below the MEMS clamped beams, the MIM capacitors connected through the leads in front and in back of the CPW signal line can be connected with the CPW ground wire, the capacitance of the MIM capacitors connected in parallel on the left side and the right side of the planar spiral inductor can be changed, and therefore the change of center frequency with four states and bandwidth is achieved.

Description

technical field [0001] The invention provides a four-state reconfigurable microwave band-pass filter and a preparation method thereof, which belong to the technical field of micro-electro-mechanical systems (MEMS). Background technique [0002] In microwave communication systems, reconfigurable filters are an important part of the front-end circuit of reconfigurable microwave transceiver components. In recent years, with the rapid development of microwave integrated circuits and MEMS technology, high-performance on-chip passive inductors can be manufactured by using micromachining and the characteristics of easy compatibility with traditional IC processes. In general, on-chip parallel-plate capacitors have a higher figure of merit and occupy a smaller die area than inductors. Since passive inductors and capacitors are the easiest way to implement on-chip filters, microwave LC passive filters based on MEMS technology can not only select and reconstruct frequencies accurately...

AI Technical Summary

Problems solved by technology

However, the existing reconfigurable LC microwave filters require multiple inductances when changing multiple center frequencies and bandwidths, and the inductance is large, which not only increases the size but also increases the parasitic conductor and substrate loss

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