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Light-sensitive solder resist ink for LED (Light Emitting Diode) backlight source

A technology of photosensitive solder resist ink and LED backlight, which is applied in the field of circuit board manufacturing, can solve the problems that cannot meet the high reflectivity of photosensitive ink of LED backlight, and achieve the effect of improving the reflectivity and uniformity of reflection

Inactive Publication Date: 2014-06-04
广东合通建业科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this technical solution and the known photosensitive ink still cannot meet the requirements of LED backlight for high reflectance of photosensitive ink, high temperature resistance and no discoloration

Method used

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  • Light-sensitive solder resist ink for LED (Light Emitting Diode) backlight source
  • Light-sensitive solder resist ink for LED (Light Emitting Diode) backlight source

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Embodiment Construction

[0012] A photosensitive solder resist ink for LED backlight, which is composed of a main agent and a hardener (curing agent) in a mass ratio of 3:1.

[0013] The main agent described in the embodiment of the present invention consists of epoxy acrylic resin, titanium dioxide, DBE solvent, isopropyl thioxanthone, 2-methyl-1-(4-methylthiophenyl)-2-morpholinyl -1-Acetone, defoaming agent, 1,2,4,5-tetramethylbenzene, in which the mass proportion of each component is epoxy acrylic resin 50%, titanium dioxide 30%, DBE solvent 7%, isopropyl Thioxanthone 1%, 2-methyl-1-(4-methylthiophenyl)-2-morpholino-1-propanone 4%, defoamer 1.4%, 1,2,4,5- Tetramethylbenzene 6.6%.

[0014] The preparation method of the epoxy acrylic resin is: weighing epoxy resin, acrylic acid, N,N-diethylbenzylamine and p-hydroxyanisole according to the mass percentages of 73.8%, 52.3%, 0.8%, and 0.1% respectively As a synthetic raw material, first dissolve the catalyst N,N-diethylbenzylamine and the polymerizati...

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Abstract

The invention aims at providing light-sensitive solder resist ink for an LED (Light Emitting Diode) backlight source. The ink consists of a main agent and a hardening agent (curing agent) according to a mass ratio of 3:1, wherein the main agent comprises the following components in percentage by mass: 50+ / -2% of epoxy acrylic resin, 30+ / -2% of titanium dioxide, 7+ / -2% of DBE (Dibasic Acid Ester) solvent, 1+ / -2% of isopropyl thioxanthone, 4+ / -2% of 2-methyl-1-(4-methylmercapto-phenyl)-2-morpholinyl-1-acetone, 1.4+ / -2% of defoaming agent and 6.6+ / -2% of 1,2,4,5-tetramethylbenzene; the hardening agent comprises the following components in percentage by mass: 35+ / -2% of epoxy resin, 16+ / -2% of triglycidyl isocyanurate, 15+ / -2% of pentaerythritol pent / hexaacrylate, 30+ / -2% of titanium dioxide and 4+ / -2% of dibasic acid ester. The ink has the advantages of high light reflection rate, high temperature resistance, fading resistance and the like.

Description

technical field [0001] The invention relates to the technical field of circuit board manufacturing, in particular to a photosensitive solder resist ink for an LED backlight source. Background technique [0002] A large-size LCD TV with a direct-lit LED backlight needs thousands of LED grains, and has high requirements for high temperature resistance and light reflection on the circuit board where the LED is installed. In the prior art, the photosensitive solder resist ink has solved the problem of poor resistance. , Poor solder resist performance, etc. For example, a Chinese patent discloses a liquid photosensitive solder resist ink, patent number: ZL201110226531.9, announcement date: 2012.04.18, mainly composed of main agent and curing agent in a mass ratio of 3:1 combined. Its beneficial effects are two-component screen printing UV contact exposure, dilute alkali developed solder resist ink, with high resolution, and the coating film after high temperature hardening has h...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D11/101C09D11/037G03F7/004G03F7/027
Inventor 陈子安
Owner 广东合通建业科技股份有限公司
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