A fan-out packaging structure and manufacturing process thereof
A technology of packaging structure and manufacturing process, which is applied in semiconductor/solid-state device manufacturing, semiconductor/solid-state device parts, semiconductor devices, etc., can solve the problems of difficult processing technology, poor stability, high cost, etc., to avoid warping, Good heat dissipation performance and low production cost
Active Publication Date: 2017-07-25
北京中科微投资管理有限责任公司
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Problems solved by technology
[0004] In the existing manufacturing methods of circuit boards and organic packaging substrates, there is a problem of incompatibility with the organic substrate technology in the application of the metal carrier board, and the cost is too high, the processing technology is very difficult, the processing quality is not high, and the stability very poor
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Embodiment Construction
[0039] see figure 1 , a fan-out packaging structure provided by an embodiment of the present invention, including a chip layer 101 provided with a chip 102, an organic substrate 103 arranged on the back of the chip 102, an organic substrate 106 arranged on the front of the chip 102, and a substrate 103 arranged on the back of the chip 102 A metal backplane 104 connected to the chip 102 as a heat sink, a blind hole 105 on the organic substrate 103 on the back of the chip 102 and a blind hole 108 on the organic substrate 106 on the front of the chip 102, a pad 109 connected to the chip 102, And fabricate the solder balls 110 fabricated on the corresponding positions of the solder pads 109 . Wherein, the organic substrate 106 is an organic substrate covered with thick copper on both sides, and the organic substrate 103 is an organic substrate covered with thick copper on one side. The base material of the organic substrate can be BT, FR-4 or high-frequency Rogers plate, etc. Th...
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The invention provides a fan-out type packaging structure which comprises a chip layer, organic substrates, a metal back plate, blind holes and a solder ball. The chip layer is provided with a chip, the organic substrates are arranged on the front and the back of the chip, the metal back plate is arranged on the substrate on the back of the chip and connected with the chip as a heat sink, the blind holes are formed in the substrates of the front and the back of the chip, and the solder ball is fixed on a solder pad connected with the chip. The invention further provides a manufacturing process of the fan-out type packaging structure. The manufacturing process comprises the steps of manufacturing a thick copper substrate and an auxiliary graph, packaging the chip, carrying out press fit, manufacturing the blind holes, reducing copper, melting copper, electroplating, manufacturing a solder mask, coating the surface and planting the ball. According to the fan-out type packaging structure and the manufacturing process of the fan-out type packaging structure, the packaging heat-dissipation performance is good, and the production cost is low.
Description
technical field [0001] The invention relates to the technical field of semiconductor chips, in particular to a fan-out packaging structure and a manufacturing process thereof. Background technique [0002] With the continuous development of information technology, mobile phones and various electronic products are becoming more and more thin and small. The performance of mobile phones and computers is getting higher and higher, and the volume is getting smaller and smaller. Higher and higher. With the continuous development and innovation of large-scale integrated circuits, the line width is close to 22 nanometers, and the integration level has reached an unprecedented level. The requirements for technology and equipment have also reached a whole new level. It is more and more difficult to further reduce the line width, it is more difficult to improve the processing capacity of technology and equipment, and the development of technology and equipment level tends to slow dow...
Claims
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IPC IPC(8): H01L23/498H01L23/367H01L23/31H01L21/50
CPCH01L24/19H01L24/25H01L2224/04105H01L2224/12105H01L2224/2518H01L2224/92144
Inventor 郭学平于中尧
Owner 北京中科微投资管理有限责任公司