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Unsaturated polyester resin composition and encapsulated motor

A polyester resin, unsaturated technology, used in circuits, electrical components, electromechanical devices, etc., can solve the problems of inability to obtain thermal conductivity cured products, high molding shrinkage of cured products, prone to cracks, etc., and achieve good heat dissipation. , The effect of small molding shrinkage and excellent curability

Active Publication Date: 2014-08-13
RESONAC CORP
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the epoxy resin composition has the following problems because the amount of the inorganic filler that can be mixed is less than that of the unsaturated polyester resin composition: a cured product with sufficient thermal conductivity cannot be obtained, or an after cure (after cure) is required. ), or the cured product has a large molding shrinkage rate and is prone to cracks, etc.
Therefore, compared with unsaturated polyester resin compositions, epoxy resin compositions have many problems in terms of moldability, workability, and physical properties of cured products.

Method used

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  • Unsaturated polyester resin composition and encapsulated motor
  • Unsaturated polyester resin composition and encapsulated motor

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～12

[0091] Put 100 moles of fumaric acid, 80 moles of propylene glycol, and 20 moles of hydrogenated bisphenol A into a four-necked flask equipped with a thermometer, a stirrer, an inert gas inlet, and a reflux condenser, and heat up to 200°C while heating and stirring under nitrogen flow , the esterification reaction is carried out according to the sequence of the conventional method, thereby obtaining an unsaturated polyester. The mass average molecular weight (MW) of this unsaturated polyester was measured under the above-mentioned conditions and found to be 10,000.

[0092] According to the ratio shown in Table 1, the unsaturated polyester obtained above and each component shown in Table 1 were kneaded using a double-bowl kneader to obtain an unsaturated polyester resin composition. Here, p-benzoquinone was used as (h) polymerization inhibitor. In addition, in Table 1, the unit of the compounding quantity of each component is mass parts.

[0093] Next, the above-mentioned ph...

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PUM

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Abstract

The present invention is an unsaturated polyester resin composition that contains (a) an unsaturated polyester, (b) a monomer that has one polymerizable carbon-carbon double bond, (c) a monomer that has two or more (meth)acrylate groups, (d) a high-thermal-conductivity filler, (e) glass fibers, (f) a shrinkage-reducing agent, (g) a hardener, and (h) a polymerization inhibitor. This unsaturated polyester resin composition is characterized in that: the mass ratio between component (b) and component (c) is between 50:50 and 75:25, inclusive; and the composition contains 400 to 1400 parts of component (d) per 100 total parts of components (a), (b), and (c) by mass. This unsaturated polyester resin composition exhibits a low molding shrinkage rate and a high thermal conductivity when cured, and despite being easy to cure, exhibits good storage stability.

Description

technical field [0001] The present invention relates to an unsaturated polyester resin composition and a sealed motor used in the fields of office automation equipment, general industrial machinery parts, automobiles, and heavy electrics. More specifically, the present invention relates to an unsaturated polyester resin composition for sealing electrical / electronic parts such as motors and coils, and a sealed motor manufactured using the composition. Background technique [0002] Unsaturated polyester resin compositions, especially bulk-molding compounds (BMC), are used as motors, coils, Sealing materials for generators and the like are widely used. [0003] In addition, regarding products such as motors in which performance degradation due to heat generation is becoming a problem, it is known from the viewpoint of improving heat dissipation that an epoxy resin composition containing an inorganic filler with high thermal conductivity can also be used as a sealing material (...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08F283/01H02K5/08
CPCH02K5/08H02K5/02H02K3/30C09K5/14C08F283/01H01L23/295C08F222/10
Inventor 板见正太郎田中优成间岛浩幸石内隆仁杉田浩昭
Owner RESONAC CORP
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