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Diazepine ketone biphenyl structure polyarylene ether toughened modified bismaleimide blend resin and preparation method thereof

A technology of bismaleimide and naphthalene ketone biphenyl is applied in the field of polymer materials, which can solve unseen problems and achieve the effects of good formability, high impact strength and heat resistance, and high impact strength

Active Publication Date: 2017-07-21
DALIAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Regarding the toughened modified DABP / BMI blend resin of polyarylether thermoplastic resin containing phthalazinone biphenyl structure and its preparation method, it has not been found in relevant patent technical reports, nor has it appeared in domestic and foreign publications

Method used

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  • Diazepine ketone biphenyl structure polyarylene ether toughened modified bismaleimide blend resin and preparation method thereof
  • Diazepine ketone biphenyl structure polyarylene ether toughened modified bismaleimide blend resin and preparation method thereof
  • Diazepine ketone biphenyl structure polyarylene ether toughened modified bismaleimide blend resin and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0049] Amino-terminated polyarylether nitrile sulfone resin / DABP / BDM blend resin with phthalazinone-containing biphenyl structure

[0050] First weigh 65g of DABP, add it into the reaction vessel and stir, gradually increase the temperature to about 80°C until the DABP melts, and when the temperature rises to about 125°C, add amino-terminated polyarylene ether nitrile containing phthalazinone biphenyl structure Sulfone (PPENS-DA) 10g, stir until it is completely dissolved in DABP, then add 100g bismaleimide diphenylmethane (BDM) into the system and continue stirring for about 30 minutes to obtain a uniform, viscous Pour the liquid into the preheated mold, and carry out vacuum degassing at 110°C for about 1 small test until no bubbles come out, then move the debubbled mold into a temperature-controlled oven, and proceed as follows Curing: Curing at 130°C for 0.5 hours, 150°C for 2 hours, 190°C for 2 hours, and 230°C for 4 hours. After curing, let it cool down to room temperatur...

Embodiment 2

[0052] Polyaryl ether sulfone resin / DABP / DABAP / BDM blend resin containing phthalazinone biphenyl structure

[0053] Weigh 15g of phthalazinone biphenyl structure polyarylethersulfone (PPES), and dissolve it in 100mL of chloroform to form a polymer solution, weigh 60gDABP and 5gDABPA and add to the reaction vessel to stir, and the temperature is gradually raised to About 80°C until DABP and DABPA melt, when the temperature rises to about 125°C, add a polymer solution containing 15g of PPES, stir until it is evenly mixed, then add 100g of bismaleimide diphenylmethane (BDM) into the Continue to stir in the system for about 40 minutes to obtain a uniform liquid with a certain viscosity. Pour the liquid into a preheated mold and perform vacuum degassing at 130°C for about 1 small test until no bubbles emerge. Move the debubbled mold into a temperature-controlled oven, and cure it according to the following procedures: 1 hour at 130°C, 2 hours at 160°C, 2 hours at 190°C, 4 hours at ...

Embodiment 3

[0055] Polyaryl ether ketone resin (PPEK) / DABP / BDM blend resin containing phthalazinone biphenyl structure

[0056] Weigh 40g DABP and 30g DABPA into the reaction vessel and stir, gradually increase the temperature to about 80°C until DABP and DABPA melt, when the temperature rises to about 125°C, add 15g PPEK, stir until it is evenly mixed, then add 100g of bis Add maleimide diphenylmethane (BDM) into the system and continue to stir for about 40 minutes to obtain a uniform liquid with a certain viscosity. Pour the liquid into a preheated mold and carry out vacuum desorption at 110 ° C. Soak for about 1 small test until no bubbles come out, move the debubbled mold into a temperature-controlled oven, and cure according to the following procedures: 130°C for 0.5 hours, 150°C for 2 hours, 190°C for 2 hours, 230°C After curing for 4 hours, let it cool down to room temperature naturally after curing. The notched impact strength of the blended resin is 4.53KJ / m2, and the glass tran...

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Abstract

The invention belongs to the field of a high polymer material, and relates to bismaleimide blending resin toughened and modified by polyarylether with phthalazinone moities and a preparation method thereof. The raw material of the blending resin comprises the following components in parts by weight: 100 parts of bismaleimide, 5-85 parts of allyl compound and 1-30 parts of polyarylether resin with the phthalazinone moitie. The preparation method of the bismaleimide blending resin toughened and modified by the polyarylether with the phthalazinone moities comprises the following steps: firstly, preparing a blending resin pre-mixture by adopting a liquid method or a melting method, and secondly, curing and molding the blending resin. The toughened BMI blending resin has good impact toughness, can be used as a resin matrix, and can be applied to preparation of a fiber-reinforced resin matrix composite with temperature resistance and high performance by laminating, mold pressing and resin transfer molding (RTM) technologies.

Description

technical field [0001] The invention belongs to the field of polymer materials, and in particular relates to a phthalazinone biphenyl structure polyarylether toughened modified bismaleimide blend resin and a preparation method thereof. Background technique [0002] Bismaleimide resin (Bismaleimide, referred to as BMI) is a bifunctional compound with maleimide (MI) as the active terminal group. BMI has the characteristics of excellent heat resistance, electrical insulation, radiation resistance, flame retardancy, good mechanical properties and dimensional stability, and is widely used in aviation, aerospace, machinery, electronics, resin matrix of advanced composite materials, resistance High temperature insulation materials and adhesives, etc. The bismaleimide resin monomer can be self-polymerized under thermal catalysis, and undergoes cross-linking reaction to form a highly cross-linked network. However, after the bismaleimide resin is cured, the crosslinking density is e...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L79/08C08L71/12C08K5/13C08G73/12
CPCC08G73/126C08L79/085C08L2201/08C08L71/126C08K5/13
Inventor 蹇锡高刘程王锦艳张守海
Owner DALIAN UNIV OF TECH
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