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A kind of packaging method of flexible semiconductor thin film electronic device

A technology for electronic devices and packaging methods, applied in the fields of semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as the deterioration of bending resistance of finished flexible devices, the complex structure of thin-film packaging layers, and the impact on device performance.

Active Publication Date: 2015-09-30
GUANG ZHOU NEW VISION OPTO ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the poor water-oxygen barrier properties of organic films, in practice, multiple inorganic / organic films with repeated structures are often required to meet the water-oxygen barrier requirements.
This not only leads to the complex structure of the thin film encapsulation layer, but also increases the production cost.
What's more serious is that the increase in the thickness of the encapsulation layer film will lead to the deterioration of the bending resistance of the finished flexible device, which will affect the performance of the device.

Method used

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  • A kind of packaging method of flexible semiconductor thin film electronic device
  • A kind of packaging method of flexible semiconductor thin film electronic device
  • A kind of packaging method of flexible semiconductor thin film electronic device

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] An encapsulation method for flexible semiconductor thin film electronic devices includes the process of preparing a water-oxygen barrier layer, wherein the water-oxygen barrier layer is formed by stacking one or more groups of water-oxygen barrier units, preferably two layers.

[0038] Each group of water-oxygen barrier units includes an organic barrier layer and an inorganic barrier layer, the surface of the organic barrier layer has an uneven topography structure, and the inorganic barrier layer is arranged on the upper surface of the organic barrier layer.

[0039] Since the surface of the organic barrier layer has an uneven topographical structure, the water-oxygen barrier unit composed of the inorganic barrier layer and the organic barrier layer can increase the scattering effect of water vapor and oxygen molecules when they diffuse inside the organic film, and at the same time reduce the water and oxygen molecules. Diffusion channels, thereby reducing the permeabil...

Embodiment 2

[0045] A packaging method for a flexible semiconductor thin film electronic device, other features are the same as those in Embodiment 1, except that an organic barrier layer is prepared by using inorganic particles doped in a photoresist as a raw material, and the surface of the organic barrier layer has some inorganic particles on its surface. A bulge that is inflated by particles.

[0046] Wherein, the particle size of the inorganic particles doped in the photoresist is 0.01-10um, and the doping amount of the inorganic particles is 0.01g / mL-5g / mL. Preferably, the particle size of the inorganic particles doped in the photoresist is 2-5 μm, and the amount of the inorganic particles incorporated is 0.2 g / mL.

[0047]The present invention forms bumps on the surface of the organic barrier layer by doping inorganic particles to form an uneven topography structure on the surface of the organic barrier layer, and prepares the inorganic barrier layer on the surface of the organic ba...

Embodiment 3

[0049] A packaging method for a flexible semiconductor thin film electronic device, other features are the same as those in Embodiment 1 or 2, the difference is that a base layer preparation process is also provided, that is, a base layer is prepared on the surface of the flexible semiconductor thin film electronic device to be packaged, and then the base layer is prepared. A water and oxygen barrier layer is prepared on the base layer.

[0050] The material of the base layer can be Al 2 O 3 or Si 3 N 4 or SiO 2 and other inorganic materials, the thickness is usually 20~200nm. The base layer and the device to be encapsulated have good adhesion performance, so that the water-oxygen barrier layer can be stably prepared on the base layer.

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Abstract

The invention discloses a packaging process of a flexible semiconductor film electronic device. The packaging process comprises a water and oxygen blocking layer preparation working procedure, wherein a water and oxygen blocking layer is formed by one or more water and oxygen blocking units in a stacking mode, each water and oxygen blocking unit comprises an organic blocking layer and an inorganic blocking layer, an uneven morphology structure is arranged on the surface of each organic blocking layer, and each inorganic blocking layer is arranged on the upper surface of the corresponding organic blocking layer. The uneven morphology structure on the surface of an organic film is a regular pattern or an irregular pattern. The uneven morphology structure on the surface of each organic blocking layer is formed in a photoetching mode or physical embossing mode or through particle addition. The uneven morphology structure of the surface of each organic blocking layer is of a rectangular structure or zigzag structure or arc structure. The flexible semiconductor film electronic device is simple in manufacturing process and high in water and oxygen blocking performance, and the device can be kept to be thin while the good water and oxygen isolation performance of the device can be achieved.

Description

technical field [0001] The invention relates to the technical field of semiconductor preparation, in particular to a packaging method for flexible semiconductor thin film electronic devices. Background technique [0002] In order to achieve a good water-oxygen insulation effect, flexible semiconductor thin film electronic devices need to be packaged after they are fabricated. In the prior art, the packaging technology for flexible semiconductor thin film electronic devices usually uses multiple materials to be stacked layer by layer, and utilizes the advantages of different materials to achieve the effect of water and oxygen isolation. [0003] At present, the most widely used material system is the inorganic / organic hybrid multi-layer film composed of inorganic thin film and organic thin film. In the inorganic / organic hybrid multilayer film structure, the inorganic film has a good water-oxygen barrier effect and plays a major role in the isolation of the multilayer film. ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/56
Inventor 徐苗李洪濛邹建华陶洪王磊彭俊彪
Owner GUANG ZHOU NEW VISION OPTO ELECTRONICS TECH