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curable composition

A composition and average composition technology, applied in the field of curable compositions, can solve the problems of encapsulants not having heat resistance and light resistance

Active Publication Date: 2016-06-08
LG CHEM LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the encapsulants disclosed in the above references do not have sufficient heat resistance and light resistance

Method used

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Examples

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Embodiment 1

[0161] Surface treatment of inorganic fillers

[0162] 20 g of an aqueous dispersion of silicon dioxide (solid content: 40% by weight, average diameter of silicon dioxide: 10 nm) was diluted with 70 g of ethanol, and then mixed with a surface treatment solution (by dissolving 15 g of both ends in 50 g of isopropanol) Hydroxyl methylphenyl oligomers (prepared by aryl molar ratio (Ar / Si): 0.4)) were mixed, and the resulting mixture was kept at room temperature for 3 days. Thereafter, unreacted substances were washed and distilled under reduced pressure to obtain a surface-treated inorganic filler.

[0163] Preparation of Curable Compositions

[0164] The curable composition is prepared by mixing compounds prepared by a known method and represented by formulas A to D so as to be curable by hydrosilylation reaction (mixing amount: compound of formula A: 80 g, compound of formula B: 20 ​​g, Compound of formula C: 200 g, compound of formula D: 70 g). Subsequently, a catalyst (pla...

Embodiment 2

[0174] 20 g of an aqueous dispersion of silicon dioxide (solid content: 40% by weight, average diameter of silicon dioxide: 10 nm) was diluted with 70 g of ethanol, and then mixed with a surface treatment solution (by dissolving 15 g of both ends in 50 g of isopropanol) Hydroxyl methylphenyl oligomers (prepared by aryl molar ratio (Ar / Si): 0.9)) were mixed, and the resulting mixture was kept at room temperature for 3 days. Thereafter, unreacted substances were washed and distilled under reduced pressure to obtain a surface-treated inorganic filler. A curable composition was prepared as described in Example 1 except that the above-mentioned inorganic filler was used.

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Abstract

The present application relates to a curable composition and its use. An exemplary embodiment of the curable composition may exhibit excellent processability and handleability. When cured, the curable composition has excellent light extraction efficiency, crack resistance, hardness, thermal shock resistance, and adhesiveness. In addition, the composition exhibits stable long-term reliability even under severe conditions, and prevents generation of turbidity or surface stickiness and the like.

Description

technical field [0001] The present application relates to a curable composition and its use. Background technique [0002] Light-emitting diodes (LEDs), especially blue or ultraviolet (UV) LEDs emitting at a wavelength of about 250 to 550 nm, are high-brightness products using GaN-based compound semiconductors such as GaN, GaAlN, InGaN, or InAlGaN. In addition, high-quality full-color images can be formed by combining red LEDs with green LEDs and blue LEDs. For example, there is known a technique of manufacturing a white LED by combining a blue or UV LED with a phosphor. Such LEDs are widely used for backlighting or general lighting of liquid crystal displays (LCDs). [0003] Epoxy resins, which have high adhesiveness and excellent mechanical durability, are currently widely used as LED encapsulants. However, the epoxy resin has low transmittance in blue or ultraviolet region, and low light resistance. Therefore, for example, in Patent Documents 1 to 3, techniques for so...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L83/04C08K9/06C08K3/22G02F1/1339
CPCC08G77/12C08G77/20C08K3/36C08K5/0025C08K5/56C08K9/06C08L83/04C08K3/22G02F1/1339H01L23/296H01L33/56H01L2924/0002C08L83/00H01L2924/00
Inventor 高敏鐏文明善郑宰昊崔范圭姜大昊金珉均赵炳奎
Owner LG CHEM LTD
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