Unlock instant, AI-driven research and patent intelligence for your innovation.

Copper foil for printed wiring boards, laminates using the same, printed wiring boards, and electronic components

A technology for printed circuit boards and laminates, applied in the directions of printed circuit components, printed circuits, printed circuits, etc., can solve problems such as difficulty in dealing with circuit patterns and difficulty in operation

Inactive Publication Date: 2016-12-21
JX NIPPON MINING & METALS CORP
View PDF11 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, if the thickness of the copper foil becomes thinner, the handling at the time of manufacture will become difficult, so it is considered that L / S=25 / 25 is the limit of the circuit pattern that can be handled by electrolytic copper foil and rolled copper foil.
It is expected that even if a metal layer such as Ni or Co is formed on the etched surface of the copper foil, it will be difficult to cope with such a circuit pattern.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Copper foil for printed wiring boards, laminates using the same, printed wiring boards, and electronic components
  • Copper foil for printed wiring boards, laminates using the same, printed wiring boards, and electronic components

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0069] Although examples of the present invention are shown below, they are provided for better understanding of the present invention and are not intended to limit the present invention.

[0070] (Example 1: Examples 1-2)

[0071] As the copper foil base material of Examples 1-2, the BHY process 18 micrometers thick rolled copper foil by JX Nikko Nippon Oil Metal Co., Ltd. was prepared. In this copper foil, the surface to be adhered to the resin is roughened, and the non-roughened surface is formed with a rustproof layer (Ni adhesion: 100μg / dm 2 , Zn adhesion amount: 300μg / dm 2 , Cr adhesion amount: 20μg / dm 2 ).

[0072] Next, after removing the antirust layer on the non-roughened surface by pickling, use Mo plating described in "(General Institution) Surface Technology Association, "Surface Technology", vol.155, No.8, p560-564" According to the following conditions, a MoNi alloy layer is formed on the non-roughened surface as a surface treatment layer. That is, first, g...

Embodiment 3～5）

[0078] As the copper foil base material of Examples 3-5, the BHY-processed 18-micrometer-thick rolled copper foil by JX Nippon Mining & Metals Co., Ltd. similar to Example 1 was prepared.

[0079] Next, after pre-processing the non-roughened surface by reverse sputtering, a Mo layer was formed by sputtering. The conditions of sputtering are shown below. The thickness of the surface treatment layer is controlled by adjusting the conveying speed, output, and Ar pressure.

[0080] ・Achieved vacuum degree: 1.0×10 -5 Pa

[0081] ・Sputtering pressure: Ar 0.2~0.4Pa

[0082] ・Sputtering power: 300~4000W

[0083] ・Copper foil conveying speed: 1-15m per minute

[0084] ・Target: Mo (3N).

[0085] Next, a CCL was produced by the procedure of Example 1, a resist pattern was formed on the Mo layer, and etching property evaluation, thermal discoloration resistance evaluation, and adhesion amount quantification were performed by the procedure of Example 1.

Embodiment 6～15）

[0087] As the copper foil base material of Examples 6-15, the BHY-processed 18 micrometer thick rolled copper foil by JX Nippon Mining & Metals Co., Ltd. similar to Example 1 was prepared.

[0088] Next, after pre-processing the non-roughened surface by reverse sputtering, a Mo layer was formed by sputtering, and NiV, Co, SnNi, ZnNi, and Cr layers were further formed by sputtering on the Mo layer. The conditions of sputtering are shown below. The thickness of the surface treatment layer is controlled by adjusting the conveying speed, output, and Ar pressure.

[0089] ・Achieved vacuum degree: 1.0×10 -5 Pa

[0090] ・Sputtering pressure: Ar 0.2~0.4Pa

[0091] ・Sputtering power: 300~4000W

[0092] ・Copper foil conveying speed: 1-15m per minute

[0093] ・Target: Mo, Ni, V, Co, Sn, Zn, Cr (3N).

[0094] Next, the thermal history of the hypothetical casting step (370°C×4h, N 2 atmosphere), make CCL.

[0095] Next, a resist pattern was formed on the surface-treated surface by ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Adhesion amountaaaaaaaaaa
Adhesion amountaaaaaaaaaa
Adhesion amountaaaaaaaaaa
Login to View More

Abstract

To provide a copper foil for a printed circuit board capable of producing lines with a small cross-sectional shape suitable for finer pitches at a good manufacturing cost. Copper foil for printed circuit boards, comprising a copper foil base material and a surface treatment layer formed on at least a part of the surface of the copper foil base material, Mo is 2000 μg / dm 2 The following adhesion amount exists in the said surface treatment layer.

Description

technical field [0001] The present invention relates to a copper foil for a printed wiring board, a laminate using the same, a printed wiring board, and an electronic component, and particularly relates to a copper foil for a flexible printed wiring board, a laminate using the same, a printed wiring board, and an electronic component. Background technique [0002] Printed circuit boards have developed tremendously over the past half century and are now used in almost all electronic instruments. In recent years, along with the increasing demand for miniaturization and high performance of electronic equipment, high-density packaging of mounted components and high-frequency signals have also been developed. For printed circuit boards, the miniaturization of conductor patterns (fine pitch ) and high-frequency response, etc. [0003] Printed circuit boards are usually manufactured through the following steps: bonding an insulating substrate to copper foil, or evaporating a Ni al...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): C23C30/00C23C14/14C25D7/06H05K1/09
CPCC25D5/50C25D1/04C25D3/562C25D5/48C25D7/0614H05K1/09H05K2201/0154H05K2201/0355
Inventor 古泽秀树
Owner JX NIPPON MINING & METALS CORP