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Resin composition for electric insulation, cured product thereof, methods for manufacturing same, and high-voltage devices and electric power transmission and distribution devices using same

A technology of resin composition and resin cured product, which is applied in the direction of rubber insulators, organic insulators, inorganic insulators, etc., which can solve the problems of reduced operability, resin cracking, and increased resin viscosity, so as to inhibit phase separation and improve dendrification resistance. , the effect of improving reliability

Inactive Publication Date: 2014-10-08
HITACHI LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The above-mentioned problems can be solved by further adding fillers, but excessive addition of fillers greatly increases the viscosity of the resin, thus reducing the workability
In addition, since air bubbles are easily involved, voids and resin cracks are likely to occur in the resin

Method used

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  • Resin composition for electric insulation, cured product thereof, methods for manufacturing same, and high-voltage devices and electric power transmission and distribution devices using same
  • Resin composition for electric insulation, cured product thereof, methods for manufacturing same, and high-voltage devices and electric power transmission and distribution devices using same
  • Resin composition for electric insulation, cured product thereof, methods for manufacturing same, and high-voltage devices and electric power transmission and distribution devices using same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0081]Preheat the mixture of bisphenol A type epoxy resin and acid anhydride curing agent as a hydrophilic insulating resin to 90°C, and mix a hydrophilic large particle size filler (crushing dioxide Silicon, average particle size 100 μm) 257 parts by weight, particulate polymer compound (particulate styrene butadiene rubber (Styrene Butadiene Rubber: SBR) having a phenyl group in the side chain) as a hydrophobic small particle size filler, primary particle diameter of 100nm or less) 5 parts by weight. Here, the SP value of the particulate polymer compound differs by 1.0 (MPa) 1 / 2 from the above-mentioned epoxy resin. In addition, a curing accelerator is appropriately added to the above mixture. Then, the mixture was kneaded while applying sufficient shear force while keeping the temperature at 90°C.

[0082] Thereafter, it was defoamed in a vacuum chamber, and heated under two-stage curing conditions of 100° C. for 5 hours (5 hours) and 170° C. for 7 hours to obtain a cured...

Embodiment 2

[0084] A resin composition containing no filler with a large particle size was prepared and used for the measurement of dendrification characteristics.

[0085] Preheat the mixture of bisphenol A type epoxy resin and acid anhydride curing agent, which is a hydrophilic insulating resin, to 90°C, and mix and hydrophobize the surface with dimethyl polysiloxane based on 100 parts by weight of the mixture. 3 parts by weight of the treated hydrophobic silica (average primary particle diameter 12nm) was used as a small particle diameter filler. In addition, to this mixture, a curing accelerator is appropriately added. Then, the mixture was kneaded while applying sufficient shear force while keeping the temperature at 90°C.

[0086] Thereafter, it was defoamed in a vacuum chamber, and heated under two-stage curing conditions of 80° C. for 5 hours and 130° C. for 14 hours to obtain a cured resin.

Embodiment 3

[0133] Figure 5 An example in which the electrical insulating resin of Example 1 is applied to the sealing of a circuit board for an inverter is shown.

[0134] The circuit board shown in this figure is provided with an insulating layer 7 and a wiring pattern 6 by using a resin composition containing an insulating resin 1, a filler material with a large particle size 2, and a mesh aggregate 4 formed of a filler material with a small particle size. 8 was formed. The wiring pattern 6 (conductor pattern) is provided on the surface of the substrate 8 via the sheet-like insulating layer 7, and in order to prevent short circuits, an insulating resin cured product (insulating material) formed by coating and curing the resin composition of the present invention is used. ) to seal.

[0135] In the structure shown in this figure, since the thermal expansion coefficient of the insulating resin 1 is suppressed by adding the large particle diameter filler 2, it is possible to suppress a...

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Abstract

In order to improve the dispersibility of a filler to thereby maintain uniform low thermal expansibility and mechanical strength, and improve the insulating property and particularly treeing-resisting property of a resin composition or a cured resin product to thereby improve the reliability of a high-voltage device, an electric power transmission and distribution device, and the like to which the resin composition or the cured resin product is applied. A resin composition for electric insulation includes insulating resin (1) that is a base material, a large particle size filler (2), and a small particle size filler (3) having a smaller particle size than the large particle size filler (2), and the large particle size filler (2) and the small particle size filler (3) are dispersed in the insulating resin (1). The insulating resin (1) and the large particle size filler (2) have an affinity for each other, and the insulating resin (1) and the small particle size filler (3) have no affinity for each other.

Description

technical field [0001] The present invention relates to a resin composition for electrical insulation, a cured product thereof, a method for producing the same, and a high-voltage device and power transmission and distribution device using the same. Background technique [0002] Insulating resins are often used as insulating materials used in high-voltage equipment such as motors and inverters; power transmission and distribution equipment such as transformers and circuit breakers. In particular, engineering plastics developed after 1970 are superior in insulation, mechanical properties, heat resistance, and weather resistance compared to previous resins, and thus have a wider range of applications. [0003] On the other hand, as a single insulating resin, the coefficient of thermal expansion is larger than that of metal materials. Therefore, in order to reduce the thermal expansion of the insulating resin, and further from the viewpoint of cost reduction and mechanical stre...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B3/40C08K3/36C08L53/02
CPCY10T428/259Y10T428/25H01B3/40Y10T428/254C08L2203/206H01B3/28H01B3/02C08L63/00C08K3/36C08L9/06
Inventor 松本启纪大狱敦佐野彰洋
Owner HITACHI LTD