Diamine, polyimide, and polyimide film and utilization thereof

A technology of polyimide film and polyimide, which is applied in the field of polyimide, can solve problems such as reaction shrinkage, warpage, and film defects, and achieve high heat resistance, low linear thermal expansion coefficient, and solution processability excellent effect

Active Publication Date: 2014-10-22
KANEKA CORP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in this method, the process of converting polyamic acid into polyimide requires heating above 300°C, so it will be accompanied by a large reaction shrinkage
Therefore, the problem with this method is not only warping due to the mismatch of linear thermal expansion coefficients between the substrate and polyimide, but also film defects due to by-product water.

Method used

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  • Diamine, polyimide, and polyimide film and utilization thereof
  • Diamine, polyimide, and polyimide film and utilization thereof
  • Diamine, polyimide, and polyimide film and utilization thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0148] (Synthesis of diamines)

[0149] The diamine (hereinafter referred to as "ABMB") expressed by the above formula (8) was synthesized by the method represented by the above formula (13). The specific synthesis method is as follows.

[0150]

[0151] Under ice cooling, to a solution obtained by dissolving 3.8023 (20.5 mmol) of 4-nitrobenzoyl chloride (4-NBC) in 6.26 mL of tetrahydrofuran (hereinafter referred to as "THF"), 3.2023 g (10 mmol) of 2,2'-bis(trifluoromethyl)benzidine (TFMB), 1.75 mL of THF, and 3.3 mL (40 mmol) of pyridine. As a result, a large amount of yellow-white precipitate was produced. After standing still for 12 hours, the obtained yellowish-white precipitate was filtered and washed thoroughly with THF and ion-exchanged water. The obtained powder was dried under reduced pressure at 100° C. for 12 hours to obtain a nitro compound as a precursor of ABMB (hereinafter referred to as “NBMB”; yield: 5.9216 g, yield: 95.7%). The obtained product was identi...

Embodiment 2

[0159] 1.6754 g (3 mmol) of ABMB were dissolved in 5.4784 g of NMP. 0.6725 g (3 mmol) of H'-PMDA was added to the obtained solution, and it stirred at room temperature for 7 hours. With NMP, the solid content concentration of the solution obtained was diluted to 10.2% by weight, and then slowly added dropwise at room temperature in the diluted solution obtained by 3.0627g (30mmol) of acetic anhydride and 1.1865g (15mmol) of pyridine. The solvents were mixed and then stirred for 24 hours. The obtained solution was added to a large amount of methanol, thereby precipitating the target product. The obtained white precipitate was sufficiently washed with methanol, and vacuum-dried.

[0160] The obtained polyimide powder was dissolved in cyclopentanone to prepare a 3% by weight solution. This solution was cast on a glass substrate, and dried at 60° C. for 2 hours with a hot air drier. Thereafter, the dried product was peeled off from the substrate, and dried at 250° C. for 1 hou...

Embodiment 3

[0163] Except for changing the film production conditions described below, it was carried out in the same manner as in Example 2. The obtained polyimide powder was dissolved in cyclopentanone to prepare a 3% by weight solution. This solution was cast on a glass substrate, and dried at 60° C. for 2 hours with a hot air dryer. After that, the dried product on the peeled substrate was dried under vacuum at 250° C. for 1 hour, and then the dried product was peeled from the glass substrate and further heat-treated at 250° C. in vacuum for 1 hour, thereby producing Got the film. Here, two types of films were produced, one of which had a film thickness of 10 μm, and these were used to measure the average linear thermal expansion coefficient and mechanical properties. The other one had a film thickness of 15 μm, which was used to measure the refractive index.

[0164] The film obtained was measured for mechanical properties, and the result was that the average elongation was 12%, t...

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Abstract

Provided are a polyimide and polyimide film having excellent solution processability, transparency, high heat resistance, and a low thermal expansion coefficient. The invention makes it possible to produce a polyimide having excellent solution processability, transparency, high heat resistance, and a low thermal expansion coefficient by using a novel diamine characterized in having an amide group and a trifluoromethyl group. This polyimide can be utilized in electronic display equipment and various other electronic devices.

Description

technical field [0001] The invention relates to a polyimide with good solution processability, low linear thermal expansion coefficient and high transparency and a preparation method thereof. The present invention also relates to a polyimide film obtained from the polyimide, and a substrate, a color filter, an image display device, an optical material, and an electronic device containing the polyimide film. Moreover, this invention also relates to the diamine which can be favorably used for manufacture of the said polyimide. Background technique [0002] Glass substrates are used in various display devices such as liquid crystal displays and organic EL (electroluminescent) displays today. A glass substrate is an excellent material because of its high heat resistance, low coefficient of linear thermal expansion, and high transparency. On the other hand, since these display devices are required to be lightweight and flexible, the industry strongly demands to find materials t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C07C237/40C08G73/10G02B5/20G02F1/1333H01L51/50H05B33/02H05B33/12
CPCH01L51/0097C07C237/40H01B3/306G02F1/133305G02B5/20C08G73/10C07C229/60C08G73/14G02B5/223H10K77/111
Inventor 长谷川匡俊石井淳一
Owner KANEKA CORP
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