Off-resonance elliptical vibration cutting device
Patent Information
- Authority / Receiving Office
- CN Β· China
- Current Assignee / Owner
- JILIN UNIV
- Publication Date
- 2014-10-29
- Estimated Expiration
- Not applicable Β· inactive patent
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Abstract
Description
Technical field
[0001] The invention belongs to the technical field of ultra-precision cutting and cutting of difficult-to-machine materials, and particularly relates to a non-resonant elliptical vibration cutting device. Background technique
[0002] Single-point diamond cutting is an effective machining method for creating precision and ultra-precision parts, with many advantages that are difficult to surpass. However, the limitation of this method is that the types of workpiece materials that can be cut are limited. Hard and brittle materials such as optical crystals, and ferrous metal materials such as hardened steel are widely used in precision parts and molds. However, these materials will cause problems during the cutting process. Severe diamond tool wear and defects such as cracks and pits on the machined surface are likely to occur. Current cutting methods are difficult to obtain satisfactory surface quality. In order to expand the range of materials that can be cut by ...