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A kind of cyanide-free cuprous electroplating copper surface modification method for iron and steel substrate

A surface modification and electroplating copper technology, which is applied in the field of surface modification of steel substrates, can solve problems such as poor bonding force of copper plating, and achieve the effects of overcoming poor bonding force, fine and compact crystallization, and reducing corrosion

Inactive Publication Date: 2016-06-22
UNIV OF JINAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The present invention aims to solve the technical problem of poor bonding force of the copper coating obtained by the existing surface modification method of cyanide-free copper plating on iron and steel substrates, and provides a surface modification method of cyanide-free cuprous electroplating copper on iron and steel substrates

Method used

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  • A kind of cyanide-free cuprous electroplating copper surface modification method for iron and steel substrate
  • A kind of cyanide-free cuprous electroplating copper surface modification method for iron and steel substrate
  • A kind of cyanide-free cuprous electroplating copper surface modification method for iron and steel substrate

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specific Embodiment approach 1

[0021] Embodiment one: a kind of cyanide-free cuprous electroplating copper surface modification method of the iron and steel substrate of the present embodiment is carried out according to the following steps:

[0022] (1) Preparation of cyanide-free cuprous electroplating solution: a. Dissolve 10 to 150 mL / L of acetic acid in deionized water in advance, and stir evenly to obtain solution A; b. ~200g / L, the concentration of organic acid complexing agent or its sodium salt is 10~120g / L, the concentration of stabilizer is 1~60g / L, and the concentration of pH buffer agent is 10~100g / L. Copper ion thiocarbonyl complexing agent, organic acid complexing agent or its sodium salt, stabilizer and pH value buffer; c. the stabilizer weighed in step b is dissolved in solution A to obtain solution B; d. Dissolve the cuprous ion thiocarbonyl complexing agent and organic acid complexing agent or its sodium salt in solution B, heat and stir until dissolved, then slowly add the pH value buffe...

specific Embodiment approach 2

[0027] Specific embodiment two: the difference between this embodiment and specific embodiment one is that the cuprous ion thiocarbonyl complexing agent described in b and d of step (1) is N-methylthiourea, tetramethylthiourea, One or a combination of ethylenethiourea, thiourea or thiosemicarbazide, the concentration is 60~180g / L. Others are the same as in the first embodiment.

[0028] When the cuprous ion thiol complexing agent of this embodiment is a composition, various cuprous ion thiol complexing agents are combined in arbitrary ratios.

specific Embodiment approach 3

[0029] Specific embodiment three: the difference between this embodiment and specific embodiment one or two is that the organic acid complexing agent described in b and d of step (1) is citric acid, ethylenediaminetetraacetic acid, gluconic acid, tartaric acid, One or a combination of aspartic acid or glutamic acid, the concentration of organic acid complexing agent or its sodium salt is 15~100g / L. Others are the same as in the first or second embodiment.

[0030] When the organic acid complexing agent or its sodium salt of this embodiment is a composition, various organic acid complexing agents or its sodium salt are combined in arbitrary ratios.

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Abstract

A method for modifying the surface of a cyanide-free cuprous electroplating copper on a steel substrate, the invention relates to a method for surface modification using a cyanide-free cuprous electroplating solution on the surface of a steel substrate. The invention aims to solve the problem that the current cyanide-free electroplating copper plating technology is applied to the surface modification of the iron and steel base body, which is easy to produce loose replacement copper layer and causes poor bonding force of the plating layer. A kind of cyanide-free cuprous electroplating copper surface modification method of iron and steel substrate: (1) use cuprous oxide, cuprous ion thiocarbonyl complexing agent, organic acid complexing agent or its sodium salt, stabilizer, pH value buffering agent , inhibitor and accelerator to prepare cyanide-free cuprous electroplating solution; (2) pre-treatment of iron and steel substrate; (3) carrying out cyanide-free cuprous electroplating copper on iron and steel substrate, and obtain a copper coating with good bonding force on the surface of iron and steel substrate. A cyanide-free cuprous electroplating copper surface modification method for iron and steel substrates can solve the current problem of cyanide-free copper electroplating on the surface of iron and steel substrates, and is conducive to the environmental protection of the copper electroplating surface modification technology for iron and steel substrates.

Description

technical field [0001] The invention belongs to the field of surface modification of iron and steel substrates, and relates to a method for surface modification of iron and steel substrates by using cyanide-free cuprous electroplating copper. Background technique [0002] Copper electroplating is an important means of steel surface treatment. Although copper plating is not commonly used as the final coating of steel substrates, it can improve the overall appearance and corrosion resistance of workpieces as an intermediate coating or primer coating for surface modification of steel substrates. play a huge role. For example, industrial valves, sliding bearings, molds and pipes are usually primed with copper plating before nickel / chrome plating to improve the corrosion resistance and brightness of the workpiece. In actual industrial production, cyanide system is mostly used in the surface modification process of electroplating copper for steel workpieces, which are highly acti...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D3/38
Inventor 田栋夏方诠施昆雁张洋开泰王园周长利
Owner UNIV OF JINAN