A method for balancing stress on dbc board and dbc board packaging structure

Abstract

The invention discloses a method for balancing stress on a DBC board and a packaging structure of the DBC board. The components attached to the DBC board include chips, accessories and metal dummy pieces. After the chips and accessories are attached according to the design layout, The metal dummy sheet is attached to the idle space left on the DBC board, so that the components attached to the DBC board are evenly distributed and uniform thermal stress is obtained. The invention uses the metal dummy sheet to fill the free area, balances the thermal stress generated by the heating of the DBC board, reduces the warpage phenomenon of the DBC board, and at the same time endows the same DBC board layout design with the ability to adapt to the production of multiple products, reducing production cost.

Description

technical field [0001] The invention relates to a component mounting method and a package structure, in particular to a method for balancing stress on a DBC board and a package structure of the DBC board. Background technique [0002] In the development of power semiconductor modules, with the improvement of integration and the reduction of volume, the power consumption per unit heat dissipation area increases, and heat dissipation becomes a key issue in module manufacturing, while traditional module structures (soldering and crimping) formula) has been unable to successfully solve the heat dissipation problem. Therefore, new requirements are put forward for the thermally conductive insulating material between the heat dissipation base plate and the chip. At present, the material used in the power electronics industry at home and abroad is generally a ceramic-metal composite board structure, referred to as DBC board (Dircet Bonding Copper). [0003] The DBC board is a comp...

AI Technical Summary

Problems solved by technology

See figure 2 As shown, the distribution of chip 11 is relatively figure 1 As shown, the number of chips 11 is small, and the idle space 13 of the DBC board 12 is large, and the thermal stress distribution is uneven during reflow soldering, causing the DBC board 12 to warp, resulting in poor performance of the product

This situation occurs in that on the DBC board 12 of the same layout design, reducing the number of chips 11 or other accessories can realize another function, so the manufacturer will apply the original DBC board 12 layout design to produce, to reduce Design costs, but this will cause the problem of a drop in the yield rate. With the current placement method, the layout can only be redesigned for new products to reduce the problem of DBC warping and deformation.

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