Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Thermal-release adhesive tape and cutting method of electronic component

A thermal peeling and adhesive tape technology, applied in the direction of adhesive types, ester copolymer adhesives, polymer adhesive additives, etc., can solve the problem of no chip retention characteristics become good, etc.

Inactive Publication Date: 2014-11-05
NITTO DENKO CORP
View PDF8 Cites 8 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] However, these known means do not make the rate of change of the probe stickiness value within a specific range, nor do they make the chip holding characteristics of the adhesive itself good when heated.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Thermal-release adhesive tape and cutting method of electronic component
  • Thermal-release adhesive tape and cutting method of electronic component
  • Thermal-release adhesive tape and cutting method of electronic component

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0162] Made in 100 parts by weight of acrylic copolymer (ethyl acrylate: 2-ethylhexyl acrylate: hydroxyethyl acrylate: methyl methacrylate = 70 parts by weight: 30 parts by weight: 5 parts by weight: 6 parts by weight) Mix 2 parts by weight of an isocyanate crosslinking agent (CORONATE L manufactured by Nippon Polyurethane Industry Co., Ltd.) and add toluene to uniformly mix the resulting solution, and apply it on a PET substrate with a thickness of 100 μm to a thickness of 10 μm after drying. (rubber-like organic elastic layer).

[0163] In addition, 2 parts by weight of an isocyanate crosslinking agent, terpene phenolic tackifier resin (YS Polystar S145 manufactured by Yasuhara Chemical Co., Ltd., hydroxyl value 100 mgKOH / g , acid value 2mgKOH / g) 30 parts by weight, and thermally expandable microspheres (Matsumoto Microsphere F-50 manufactured by Matsumoto Yushi Pharmaceutical Co., Ltd.) 35 parts by weight of the toluene solution, which is coated on the PET substrate separat...

Embodiment 2

[0166] 100 parts by weight of the above-mentioned acrylic copolymer were mixed with 2 parts by weight of an isocyanate crosslinking agent (CORONATE L manufactured by Nippon Polyurethane Industry Co., Ltd.), a terpene phenolic tackifier resin (TAMANOL 901 manufactured by Arakawa Chemical Co., Ltd., Hydroxyl value 45mgKOH / g, acid value 52mgKOH / g) 30 parts by weight, and heat-expandable microspheres (Matsumoto Microsphere F-50 manufactured by Matsumoto Yushi Pharmaceutical Co., Ltd.) 35 parts by weight of toluene solution, which is coated on PET On the substrate separator (38 μm), the thickness after drying was 35 μm (heat-expandable adhesive layer 2). Except having used the heat-expandable pressure-sensitive adhesive layer 2, the heat-peelable pressure-sensitive adhesive sheet 2 was obtained by the method similar to Example 1.

Embodiment 3

[0168]2 parts by weight of an isocyanate crosslinking agent (CORONATE L manufactured by Nippon Polyurethane Industry Co., Ltd.), rosin phenolic tackifier resin (SUMILITE manufactured by SUMITOMO BAKELITE CO., LTD.) were prepared by mixing 100 parts by weight of the above-mentioned acrylic copolymer. RESIN PR-12603, acid value 65mgKOH / g) 30 parts by weight, and heat-expandable microspheres (Matsumoto Microsphere F-50 manufactured by Matsumoto Yushi Pharmaceutical Co., Ltd.) 35 parts by weight of toluene solution, which was coated on the PET substrate On a material separator (38 μm), the thickness after drying was 35 μm (thermally expandable adhesive layer 3). A heat-peelable pressure-sensitive adhesive sheet 3 was obtained in the same manner as in Example 1 except that the heat-expandable pressure-sensitive adhesive layer 3 was used.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
elastic modulusaaaaaaaaaa
Login to View More

Abstract

The invention relates to a thermal-release adhesive tape and a cutting method of an electronic component. An object of the invention is to provide an adhesive tape capable of fully fixing a chip even when being cut off, preventing chip flyoff in a cutting process, and increasing yield of the chip in the cutting process. The thermal-release adhesive tape has a thermal-expansion adhesive layer. When a probe tack value of the thermal-expansion adhesive is set as B0 and the probe tack value of the thermal-expansion adhesive after being stood for 1 week at a temperature of 0 DEG C as B, a variable rate of the probe tack value shown as a formula 1 is below 19.0%. W=|(B0-B) / B0*100|

Description

technical field [0001] The present invention relates to a heat-peelable pressure-sensitive adhesive tape for fixing electronic components when processing electronic components and the like, and a method for cutting electronic components using the same. Background technique [0002] In fields such as semiconductors, wafers are being increased in diameter (450 mm) and thinner (less than 100 μm), and the demand for compound semiconductors, such as LEDs, that require careful handling is increasing significantly. [0003] In addition, in the processing of electronic components, heat-peelable adhesive sheets are widely used, which can be reliably fixed during processing, lose their adhesive force when heated after processing, and can easily peel off the object to be processed. [0004] In recent years, electronic components have been miniaturized and refined, and machining accuracy is required more than ever before. For example, ceramic capacitors are being miniaturized from 1005...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/02C09J7/04
CPCC09J7/40C09J9/00C09J11/08C09J133/04C09J2421/006C09J2467/006
Inventor 北山和宽下川大辅平山高正副岛和树
Owner NITTO DENKO CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com