UV-curable conductive adhesive

A conductive adhesive and curing technology, which is applied in the field of conductive adhesive, can solve the problems of high curing temperature, long curing time, and mass production restrictions of conductive adhesive, and achieve the effects of improving market competitiveness, short curing time, and improving production efficiency

Inactive Publication Date: 2014-11-19
DONGGUAN MEISHENG ELECTRICAL PROD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to solve the problem of high curing temperature and long curing time of conductive adhesives, which lead to limited mass produ

Method used

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Examples

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Example Embodiment

[0013] The present invention will be further illustrated by specific embodiments below.

[0014] A UV-curable conductive adhesive. The components of the UV-curable conductive adhesive include: modified acrylic oligomer, acrylic monomer, photoinitiator, auxiliary agent, conductive and thermally conductive filler; unit mass of the components The percentages are as follows: modified acrylic oligomer 5-20%; acrylic monomer 10-35%; photoinitiator 2-5%; auxiliary agent 0.5-2%; conductive and thermally conductive filler 5-80%.

[0015] As a preferred embodiment, the unit mass percentages of the modified acrylic oligomer, acrylic monomer, photoinitiator, auxiliary agent, and conductive and thermally conductive filler are as follows: modified acrylic oligomer 10%; acrylic monomer 10%; photoinitiator 3%; auxiliary agent 2%; conductive and thermal conductive filler 75%.

[0016] Specifically, the modified acrylic oligomer includes epoxy acrylate oligomer, tertiary amine co-initiator oligomer, ...

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Abstract

The invention discloses a UV-curable conductive adhesive. The UV-curable conductive adhesive comprises, by mass, 5-20% of a modified acrylate oligopolymer, 10-35% of an acrylic acid monomer, 2-5% of a photoinitiator, 0.5-2% of an assistant and 5-80% a conductive heat conduction filler. The UV-curable conductive adhesive can substantially reduce the conductive adhesive curing time, and is convenient for realizing the fully automatic production of a whole technology in order to improve the production efficiency; and the curing time is short, so electric energy reduction benefiting, environmental protection, energy saving and production cost reduction are realized, and the requirements of the modern development and the improvement of the market competitiveness are satisfied.

Description

technical field [0001] The invention relates to a conductive adhesive, in particular to a UV curable conductive adhesive. Background technique [0002] With the rapid development of the electronics industry, the packaging technology of microelectronics is developing in the direction of high speed, high density, light weight, and miniaturization. Some traditional soldering materials such as Sn-Pb are far from meeting this refined technology. Therefore, the research and development of new materials with low energy consumption and environmental friendliness has become an inevitable development trend. [0003] The conductive adhesive has become a new type of connecting material to replace Sn-Pb solder due to its excellent characteristics. Conductive adhesive is a composite material composed of high molecular polymer and conductive particles. The polymer imparts connection properties, and the conductive particles impart electrical conductivity. Conductive adhesive has certain...

Claims

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Application Information

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IPC IPC(8): C09J4/02C09J163/10C09J175/14C09J167/06C09J183/00C09J9/02C09J11/04
Inventor 叶逸仁郑香奕
Owner DONGGUAN MEISHENG ELECTRICAL PROD
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