Microprocessor electromagnetic and thermal stress composite environmental sensitivity test system and method

Abstract

The invention relates to an electromagnetic and thermal stress complex environmental sensitivity testing method for a microprocessor. An RF interference signal source (1), a power amplifier (2), a coupling capacitor (3), a power supply distribution network (4), a tested microprocessor (5), a PCB (6), a thermostatic heating tank (7), a DC power supply (8) and an oscilloscope (9) are included. The method also provides a capacity coupling injection interference based method for testing the electromagnetic and thermal stress complex environmental sensitivity of a microprocessor. The system is easy to build, low in cost and quick and convenient in testing, and solves the problem that the testing of the electromagnetic and thermal stress complex sensitivity of the microprocessor is difficult; meanwhile, the testing method is simple, the operating process is definite, the electromagnetic sensitivity of the microprocessor at different work environment temperatures can be accurately tested within the whole frequency band ranging from 150 KHz to 1 GHz, and sample testing can be carried out at an appointed operating temperature or a certain frequency point.

Description

technical field [0001] The invention relates to the field of electromagnetic robustness testing of microprocessors, in particular to a method for testing the combined environmental sensitivity of electromagnetic and thermal stress of microprocessors. Background technique [0002] As the core of electronic information systems, microprocessors have been widely used in key fields such as aerospace, space technology, transportation, and national defense. In a complex electromagnetic and harsh temperature environment, the intrinsic indicators of microprocessor electromagnetic compatibility will drift and deteriorate, leading to electromagnetic robustness problems such as increased sensitivity to the electromagnetic environment of chips and systems and reduced reliability. Electromagnetic robustness refers to the electromagnetic compatibility durability and functional safety reliability of a chip or system's life-cycle task profile in complex electromagnetic and climatic environme...

AI Technical Summary

Problems solved by technology

For the test of integrated circuit susceptibility, ICE62132-3 provides the test standard of Direct Power Injection (DPI), which solves the test problem of device susceptibility, but this EMC test method does not consider the influence factors of environmental temperature changes, and Insufficient isolation between the power supply decoupling network and the interference signal makes the DC voltage stabilizer vulnerable to the influence of the injected interference signal

For the reliable aging test of components, GJB548B-2005 and MIL-STD-883H (Department Of Defense Test Method Standard, Microcircuits, 26February 2010) have standardized related test methods, but this method does not consider the influence of electromagnetic stress

The Chinese patent "A Test System and Test Method for Electromagnetic Anti-interference Performance of Body Controller" (CN102707706) published on October 3, 2012 provides a test method for electromagnetic anti-interference performance of body controller, which solves the problem of The electromagnetic immunity test of the body controller, but this method does not involve the temperature-affected immunity factor, and the test requires a microwave darkroom environment, which is expensive

The invention provides a microprocessor electromagnetic and thermal stress compound environment sensitivity test method, which considers the electromagnetic and thermal stress compound effect factors, and solves the robustness test problem of complex electromagnetic and physical temperature environments

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