Defoaming method of polyamide acid resin salivation liquid film and device thereof

A technology of polyamic acid resin and defoaming device, which is applied in application, coating, household appliances, etc., can solve the problem that there is no effective defoaming method and device for polyamic acid resin salivating liquid film, and achieve defoaming process operation Convenience, improved thickness uniformity, and reduced chromatic aberration

Active Publication Date: 2014-12-03
GUILIN ELECTRICAL EQUIP SCI RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] There is no effective defoaming method and device for polyamic acid resin salivation film at present

Method used

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  • Defoaming method of polyamide acid resin salivation liquid film and device thereof
  • Defoaming method of polyamide acid resin salivation liquid film and device thereof

Examples

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Embodiment Construction

[0029] The embodiment of the defoaming device of this polyamic acid resin salivation film is for example figure 1 As shown, it comprises a polyamic acid resin solution extrusion die 1, a steel belt 4 and a drool oven 5, and the endless steel belt 4 circulates around the front drum 3 and the rear drum 8, and the lip of the extrusion die 1 is located opposite to The steel belt 4 at the highest point of the front drum 3 has three sets of high-temperature solvent gas boxes 6 and vacuum boxes 7 behind the extrusion die 1, and a front high-temperature solvent gas box 6 and a vacuum box 7 next to each other form a group , the steel strip 4 carrying the polyamic acid resin liquid film obtained by salivation passes through each group of high-temperature solvent gas boxes 6 and vacuum boxes 7 in sequence, and then enters the salivation oven 5 .

[0030] The high-temperature solvent gas box 6 is a closed box, with a steel strip inlet on the front end and a steel strip outlet on the rear ...

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Abstract

The invention relates to a defoaming method of a polyamide acid resin salivation liquid film and a device of the defoaming method; a polyamide acid resin liquid film prepared by salivation is processed by using high-temperature solvent gas, processed in vacuum and dried sequentially, so that a polyamide acid film having self-supporting property is formed; the processing temperature of the high-temperature solvent gas is 40-180 DEG C; the concentration of a solvent is 0.5-100 g/m<3>; the processing time for each time is 0.1-1 min; the solvent is the same to that in synthesis of polyamide acid resin; the vacuum processing negative pressure is -0.1-0 MPa; and the time is 0.1-3 min. The defoaming device disclosed by the invention is provided with N sets of high-temperature solvent gas boxes and vacuum boxes between a forming mould and a salivation oven; a steel belt carried with the salivation film passes through the high-temperature solvent gas boxes and the vacuum boxes in sequence and then enters the salivation oven; an attaching vacuum chamber is arranged at the rear of the forming mould, so that the liquid film is attached to the steel belt rapidly and smoothly; tiny bubbles in the liquid film are completely eliminated; the quality of a polyimide film is increased; and the device is simple and convenient to operate.

Description

technical field [0001] The invention relates to a polyimide film manufacturing technology, in particular to a defoaming method and device for a polyamic acid resin salivation liquid film. Background technique [0002] Polyimide film is a polymer material with excellent properties such as high strength, high toughness, wear resistance, high temperature resistance, and corrosion resistance. It is widely used in the electrical and electronic industries, especially in various high-end electronic products in the electronics industry. main base material. [0003] With the development trend of light, thin, short, small and high-reliability design of downstream electronic products, the polyimide film demanded by the market tends to be thinner, and the polyimide film with a thickness of ≤12.5 μm is favored to reduce The weight and volume of downstream products using polyimide film as a small substrate. Since the density of the downstream product wiring reaches the micron level, it ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C41/34B29C41/28B29K77/00B29L7/00
Inventor 任小龙冯俊杰
Owner GUILIN ELECTRICAL EQUIP SCI RES INST
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