Surface mount technology (SMT) red adhesive

A patch red, modified technology, applied in the direction of adhesives, adhesive additives, non-polymer adhesive additives, etc., can solve the problems of low curing temperature, single method, temperature sensitivity, etc., to improve toughness and impact strength. , the effect of increasing the operating window and reducing the internal stress

Active Publication Date: 2014-12-03
东莞市新懿电子材料技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The patch red glue in the prior art generally uses epoxy resin as the main component, and the glass transition temperature (Tg) of epoxy resin is relatively low (the Tg of epoxy resin imported from Japan is currently up to 165°C), which leads to The Tg of the finished product of flake red glue is relatively low. During the manufacturing process, two or more wave soldering (temperature about 260 ℃ ~ 320 ℃) ​​will lead to the phenomenon of falling parts, so it cannot meet the current and future high-end products at all. Process requirements
[0

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0046] A patch red glue provided in this embodiment comprises the following components in mass percentage: 65% of propylamino polymethylphenylsiloxane modified o-cresol novolac epoxy resin;

[0047] Ultrafine crushed dicyandiamide 10%;

[0048] Tetraethylammonium bromide 1.5%;

[0049] Phenyl glycidyl ether 15%;

[0050] Nano calcium carbonate 5%;

[0051] Fumed silica 3%;

[0052] Toner macromolecular red 0.5%.

[0053] Among them, in the silicone-modified epoxy resin (that is, the modified o-cresol novolac epoxy resin terminated with propylaminopolymethylphenylsiloxane), the mass ratio of terminated propylaminopolymethylphenylsiloxane is 40%. .

[0054] Its preparation method comprises the following steps:

[0055] The first step, the preparation of propylamino polymethylphenylsiloxane modified o-cresol novolac epoxy resin: o-cresol novolac epoxy resin and xylene as solvent are added in the container, heated while stirring, and the temperature is raised to 80°C, keep ...

Embodiment 2

[0059] A patch red glue provided in this embodiment comprises the following components in mass percent: 50% of propylamino polymethylphenylsiloxane modified o-cresol novolac epoxy resin;

[0060] Condensate of imidazole and epoxy resin 17%;

[0061] Triphenylphosphine 2%;

[0062] Ethylene glycol diglycidyl ether 18%;

[0063] Polysulfide rubber 9%;

[0064] Organic bentonite 3.7%;

[0065] Toner Fast Red 0.3%.

[0066] Among them, in the organosilicon-modified epoxy resin (that is, the modified o-cresol novolac epoxy resin terminated with propylaminopolymethylphenylsiloxane), the mass ratio of terminated propylaminopolymethylphenylsiloxane is 50%. .

[0067] The preparation method of this patch red gum comprises the following steps:

[0068] The first step, preparation of o-cresol novolac epoxy resin modified by propylamino polymethylphenylsiloxane: add o-cresol novolac epoxy resin and xylene as solvent into the container, heat while stirring, and adjust the temperature...

Embodiment 3

[0072] A kind of patch red glue, it comprises the component of following mass percent: Terminated propylaminopolymethylphenylsiloxane modified o-cresol novolac epoxy resin 70%;

[0073] Anhydride curing agent 9%;

[0074] Benzyltriethylammonium chloride 1%;

[0075] Octyl Glycidyl Ether 10%;

[0076] Nano Titanium Dioxide 5%;

[0077] Polyamide wax 4.3%;

[0078] Toner cadmium red 0.7%.

[0079] Among them, in the silicone-modified epoxy resin (that is, the modified o-cresol novolac epoxy resin terminated with propylaminopolymethylphenylsiloxane), the mass ratio of terminated propylaminopolymethylphenylsiloxane is 60%. .

[0080] The preparation method of this patch red gum comprises the following steps:

[0081] The first step, preparation of o-cresol novolac epoxy resin modified by propylamino polymethylphenylsiloxane: add o-cresol novolac epoxy resin and xylene as solvent into the container, heat while stirring, and adjust the temperature to 85°C, keep it warm for 2h...

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PUM

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Abstract

The invention belongs to the technical field of adhesives, and in particular relates to a surface mount technology (SMT) red adhesive. The SMT red adhesive comprises the following components in percentage by weight: organic silicon modified epoxy resin, a curing agent, a promoter, a thinner, a toughening agent and a thixotropic agent, wherein the organic silicon modified epoxy resin is propylamino-terminated polymethylphenylsiloxane modified o-cresol-formaldehyde epoxy resin; in the organic silicon modified epoxy resin, propylamino-terminated polymethylphenylsiloxane accounts for 5-60% by mass. Compared with the prior art, the SMT red adhesive disclosed by the invention has the advantages that by adopting the organic silicon modified epoxy resin, the internal stress of epoxy resin can be reduced and the toughness, heat resistance and glass-transition temperature (Tg) of the epoxy resin can be improved, so that the resin has relatively good toughness, adhesive performance and anti-impact performance. The increase of Tg can prevent component dropping phenomena generated in production and manufacturing processes when performing two or more wave-soldering (at a temperature of about 260-320 DEG C), and the use requirements on high-end technologies at present and in the future can be met.

Description

technical field [0001] The invention belongs to the technical field of adhesives, and in particular relates to a patch red glue. Background technique [0002] With the rapid development of the electronics industry, the closely related electronic packaging technology is becoming more and more advanced, and SMT surface assembly technology is one of the packaging technologies. A typical process flow of SMT surface assembly technology is patch glue-wave soldering process, which is to bond chip components on one surface of the PCB board with patch glue, and on the other side of the PCB board. Insert through-hole components or SMD components on the top, and then the assembly work can be successfully completed by wave soldering. [0003] The patch red glue in the prior art generally uses epoxy resin as the main component, and the glass transition temperature (Tg) of epoxy resin is relatively low (the Tg of epoxy resin imported from Japan is currently up to 165°C), which leads to ...

Claims

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Application Information

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IPC IPC(8): C09J187/00C09J11/06C08G81/00
Inventor 黄剑滨居仁贤黄伟希
Owner 东莞市新懿电子材料技术有限公司
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