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A kind of electronic encapsulation material and preparation method thereof of rapid curing at room temperature

An electronic packaging material, fast curing technology, used in non-polymer adhesive additives, adhesive types, polyether adhesives, etc., to achieve high adhesion, increased service life, and easy sizing

Inactive Publication Date: 2016-01-13
YANTAI DARBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The invention provides an electronic packaging material that can be quickly cured at room temperature and a preparation method thereof. The electronic packaging material-adhesive prepared by the invention does not depend on temperature heating, and can be cured in a conventional standard room temperature environment in a short time. To achieve the required performance, to solve the various deficiencies in the existing adhesives

Method used

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  • A kind of electronic encapsulation material and preparation method thereof of rapid curing at room temperature
  • A kind of electronic encapsulation material and preparation method thereof of rapid curing at room temperature

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] 30 parts of silane-terminated polyether S303H, 30 parts of silane-terminated polyurethane 1050MM, 5 parts of diisononyl phthalate, 4 parts of Sylophobic702, 1 part of bis(2,2,6,6-tetramethyl-4 -piperidinyl) sebacate, 1 part of 2-(2'-hydroxy-3'5'-di-tert-butyl)-5-chloro-benzotriazole was added to the stirring tank in turn, stirred and dispersed for 60 minutes and Vacuum, the vacuum degree is not less than -0.098MPa, then add 1 part of vinyltrimethoxysilane into the stirred tank and mix for 10 minutes under nitrogen protection, 1 part of N-β-aminoethyl-γ-aminopropyltrimethoxy Add silane into the stirred tank and mix for 10 minutes under nitrogen protection. Finally, add 0.5 parts of U-220H into the stirred tank and mix for 10 minutes under vacuum. The vacuum degree is not less than -0.098MPa, N 2 Just seal the package.

Embodiment 2

[0024] 50 parts of silane-terminated polyether SAT400, 50 parts of silane-terminated polyurethane 1050MM, 20 parts of diisodecyl phthalate, 8 parts of Sylophobic702, 2 parts of bis(2,2,6,6-tetramethyl-4 -piperidinyl) sebacate, 2 parts of 2-(2'-hydroxy-3'5'-di-tert-butyl)-5-chloro-benzotriazole were added to the stirring tank in turn, stirred and dispersed for 60 minutes and Vacuum, the vacuum degree is not less than -0.098MPa, then add 3 parts of vinyltrimethoxysilane into the stirred tank and mix for 10 minutes under nitrogen protection, 4 parts of N-β-aminoethyl-γ-aminopropyltrimethoxy Add silane into the stirred tank and mix for 10 minutes under nitrogen protection. Finally, add 2 parts of stannous octoate into the stirred tank and mix for 10 minutes under vacuum. The vacuum degree is not less than -0.098MPa, N 2 Just seal the package.

Embodiment 3

[0026] 40 parts of silane-terminated polyether MAX602, 40 parts of silane-terminated polyurethane 1050MM, 12 parts of SAX-015, 6 parts of Sylophobic702, 1.5 parts of bis(2,2,6,6-tetramethyl-4-piperidinyl) Sebacate, 1.5 parts of 2-(2'-hydroxy-3'5'-di-tert-butyl)-5-chloro-benzotriazole were sequentially added into the stirring tank, stirred and dispersed for 60 minutes and vacuumed, the vacuum degree Not less than -0.098MPa, then add 2 parts of methyltrimethoxysilane into the stirring tank and mix for 10 minutes under nitrogen protection, 1.5 parts of N-β-aminoethyl-γ-aminopropyltrimethoxysilane and 1 part of γ - Add glycidyloxypropyltrimethoxysilane into the stirring tank and mix for 10 minutes under nitrogen protection. Finally, add 1.2 parts of U-220H into the stirring tank and mix for 10 minutes under vacuum. The vacuum degree is not less than -0.098MPa, N 2 Just seal the package.

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Abstract

The room temperature fast-curing electronic packaging material prepared by the invention does not depend on temperature heating, can be cured in a conventional standard room temperature environment, and can achieve the required properties in a short time, which solves various problems existing in the existing adhesives. insufficient. The material is composed of the following raw materials: 30-50 parts of silane-terminated polyether, 30-50 parts of silane-terminated polyurethane, 5-20 parts of plasticizer, 4-8 parts of reinforcing filler, 1-2 parts of ultraviolet light absorber , 1-2 parts of light stabilizer, 1-3 parts of water remover, 1-4 parts of tackifier, 0.5-2 parts of catalyst.

Description

technical field [0001] The invention relates to an electronic packaging material that can be quickly cured at room temperature, and belongs to the field of electronic packaging. Background technique [0002] With the rapid development of the electronics industry, the high density and high speed of electronic packaging and assembly, integrated circuits put forward stricter requirements on the performance of packaging materials; at the same time, the harshness of market competition limits the price of packaging materials. [0003] The packaging material involved in the present invention is used for the bonding and fixing of PC and FR4 in the mobile phone power charger, and it is required to be able to quickly solidify at room temperature, be non-corrosive to the substrate, and quickly meet the requirements. Good bonding strength and impact resistance. Some domestic bonding materials that can be used in the market have some different disadvantages: some have slow curing speed,...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J171/00C09J175/04C09J11/06
Inventor 林春霞王建斌陈田安解海华
Owner YANTAI DARBOND TECH
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