Photo-curable thermosetting composition, method of manufacturing cured product thereof, cured product, and printed circuit board having same
A heat-curable and light-curable technology, applied in printed circuit, printed circuit manufacturing, printed circuit secondary treatment, etc., can solve problems such as difficult to obtain high-definition patterns, achieve excellent storage stability, excellent physical properties, Withstand the effect of long-term use
Active Publication Date: 2014-12-10
TAIYO INK MFG
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- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
On the other hand, the screen printing method uses a stencil for the above-mentioned pattern form
Method used
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[0114] [Examples 1 to 8, and Comparative Examples 1 to 9]
[0115] I. Preparation of the composition
[0116] Each component was mixed in the ratio shown in Table 1, and it stirred with the dissolver. Regarding Examples 7 and 8, dispersion was further carried out with a bead mill, followed by filtration with a disc filter of 1 μm. Thus, the composition of the present invention and the comparative composition were obtained.
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Provided is a photo-curable thermosetting composition which has suitable viscosity for application to inkjet printers, can render patterns directly on a PCB substrate, cures at comparatively low temperatures, and further has, after curing, excellent adhesion, chemical resistance, heat resistance, and insulating properties. This photo-curable thermosetting composition is characterized by containing (meth)acryloyl group-containing monomers, blocked isocyanate, and a photo-polymerization initiator and by being applicable to inkjet printing.
Description
technical field [0001] The present invention relates to a photo / thermosetting composition, and particularly relates to a photo / thermosetting composition that can be suitably used for printing by an inkjet method. [0002] Furthermore, this invention relates to the manufacturing method of the hardened|cured material obtained using the said photo / heat-curable composition, a hardened|cured material, and the printed wiring board which has a hardened|cured material. Background technique [0003] Conventionally, a photographic development method and a screen printing method have been used to form a resist film, a solder resist film, and a mark of a printed circuit board. [0004] In the photographic development method, a photosensitive resin material and a photomask are applied on a substrate, and exposed to light so that only the part of the photosensitive resin material not covered by the photomask is photocured, and the uncured part is dissolved by a developer solution, thereby...
Claims
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Login to view more IPC IPC(8): C09D11/30B41M5/00C08F2/44H05K3/28
CPCH05K2203/013H05K3/287C08F222/1006B41M7/009C08F2/48C09D11/101C09D11/322C08F222/102C08F222/103Y10T428/24802Y10T428/24917B41J2/00C08F220/18C08G18/62C09D11/107G03C1/498C09D11/30
Inventor 崔城豪志村优之依田健志宇敷滋
Owner TAIYO INK MFG
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