Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Photo-curable thermosetting composition, method of manufacturing cured product thereof, cured product, and printed circuit board having same

A heat-curable and light-curable technology, applied in printed circuit, printed circuit manufacturing, printed circuit secondary treatment, etc., can solve problems such as difficult to obtain high-definition patterns, achieve excellent storage stability, excellent physical properties, Withstand the effect of long-term use

Active Publication Date: 2014-12-10
TAIYO INK MFG
View PDF12 Cites 11 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

On the other hand, the screen printing method uses a stencil for the above-mentioned pattern formation and transfers ink with a squeegee, but it is difficult to obtain a high-definition pattern.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Photo-curable thermosetting composition, method of manufacturing cured product thereof, cured product, and printed circuit board having same
  • Photo-curable thermosetting composition, method of manufacturing cured product thereof, cured product, and printed circuit board having same
  • Photo-curable thermosetting composition, method of manufacturing cured product thereof, cured product, and printed circuit board having same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～8、 and comparative example 1～9

[0115] I. Modulation of Composition

[0116] Each component was mixed in the ratio shown in Table 1, and this was stirred with the dissolver. Regarding Examples 7 and 8, dispersion was further performed with a bead mill, followed by filtration with a 1 μm disc filter. Thus, the composition of this invention and a comparative composition were obtained.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

Provided is a photo-curable thermosetting composition which has suitable viscosity for application to inkjet printers, can render patterns directly on a PCB substrate, cures at comparatively low temperatures, and further has, after curing, excellent adhesion, chemical resistance, heat resistance, and insulating properties. This photo-curable thermosetting composition is characterized by containing (meth)acryloyl group-containing monomers, blocked isocyanate, and a photo-polymerization initiator and by being applicable to inkjet printing.

Description

technical field [0001] The present invention relates to a photo / thermosetting composition, and particularly relates to a photo / thermosetting composition that can be suitably used for printing by an inkjet method. [0002] Furthermore, this invention relates to the manufacturing method of the hardened|cured material obtained using the said photo / heat-curable composition, a hardened|cured material, and the printed wiring board which has a hardened|cured material. Background technique [0003] Conventionally, a photographic development method and a screen printing method have been used to form a resist film, a solder resist film, and a mark of a printed circuit board. [0004] In the photographic development method, a photosensitive resin material and a photomask are applied on a substrate, and exposed to light so that only the part of the photosensitive resin material not covered by the photomask is photocured, and the uncured part is dissolved by a developer solution, thereby...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C09D11/30B41M5/00C08F2/44H05K3/28
CPCH05K2203/013H05K3/287C08F222/1006B41M7/009C08F2/48C09D11/101C09D11/322C08F222/102C08F222/103Y10T428/24802Y10T428/24917B41J2/00C08F220/18C08G18/62C09D11/107G03C1/498C09D11/30
Inventor 崔城豪志村优之依田健志宇敷滋
Owner TAIYO INK MFG
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com