Thin tungsten copper sheet and preparing method of thin tungsten copper sheet

A technology of tungsten-copper and flakes, which is applied in the field of tungsten-copper flakes and its preparation, can solve problems such as difficulty in pressing large-size flakes, high cost, and difficult mixing of powders, so as to achieve high green compact density and overcome uneven density distribution , The effect of uniform compact density

Active Publication Date: 2014-12-17
安泰天龙钨钼科技有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The production methods of tungsten-copper alloys can be roughly divided into two categories. One is tungsten powder compacting-copper infiltration; the other is powder mixing sintering-rolling. The grade tungsten-copper alloy is difficult to roll; the latter is prone to produce tungsten and copper enriched areas because the powder is difficult to mix uniformly
Therefore, the current high-end tungsten-copper microelectronic packaging sheets can only be produced by grinding thicker (above 1mm) tungsten-copper sheets, which is not efficient and the cost remains high, and large-sized ultra-thin sheets such as 6 inches, 0.1 mm thick W90Cu10 pieces (for LED) are difficult to grind

Method used

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  • Thin tungsten copper sheet and preparing method of thin tungsten copper sheet

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 10

[0087] Embodiment 10.1mm thickness W50Cu50 sheet

[0088] (1) Prepare tungsten copper dispersion powder

[0089] The tungsten-copper dispersion powder used in this example was purchased from Hunan Sairui New Material Co., Ltd., and its brand name is W50Cu50. The tungsten-copper dispersion powder is prepared by chemical co-precipitation of tungsten and copper. The distribution of tungsten and copper is even, and its weight ratio is 1:1.

[0090] (2) Steel mold pressing

[0091] Put the powder of step (1) into a steel mold, press and form it on a hydraulic press, the pressure of the press is 120MPa, and obtain a steel mold-molded green compact with a thickness of 20mm.

[0092] (3) Cold isostatic pressing

[0093] Put the steel molded compact in step (2) into the aluminum-plastic composite film for vacuum packaging, and repress it in a cold isostatic press. The isostatic pressure is 250MPa. Take it out from the vacuum aluminum-plastic composite film to obtain a composite com...

Embodiment 20

[0114] Embodiment 20.1mm thickness W80Cu20 sheet

[0115] (1) Prepare tungsten copper dispersion powder

[0116] The tungsten-copper dispersion powder used in this example was purchased from Hunan Sairui New Material Co., Ltd., and the brand name is W80Cu20. The tungsten-copper dispersion powder is prepared by chemical co-precipitation method of tungsten and copper. The distribution of tungsten and copper is uniform, and its weight ratio is 4:1.

[0117] (2) Steel mold pressing

[0118] Put the powder of step (1) into a steel mold, press and form it on a hydraulic press, the pressure of the press is 160MPa, and obtain a steel mold-molded green compact with a thickness of 15mm.

[0119] (3) Cold isostatic pressing

[0120] Put the steel molded compact in step (2) into the aluminum-plastic composite film for vacuum packaging, and repress in a cold isostatic press. The isostatic pressure is 260MPa, and then the isostatically pressed tungsten copper Take it out from the vacuum...

Embodiment 30

[0141] Embodiment 30.1mm thickness W90Cu10 sheet

[0142] (1) Prepare tungsten copper dispersion powder

[0143] The tungsten-copper dispersion powder used in this example was purchased from Hunan Sairui New Material Co., Ltd., and its brand name is W90Cu10. The tungsten-copper dispersion powder is prepared by chemical co-precipitation of tungsten and copper. The distribution of tungsten and copper is uniform, and its weight ratio is 9:1.

[0144] (2) Steel mold pressing

[0145] Put the powder of step (1) into a steel mold, press and form it on a hydraulic press, the pressure of the press is 160MPa, and obtain a steel mold-molded green compact with a thickness of 10mm.

[0146] (3) Cold isostatic pressing

[0147] Put the steel molded compact in step (2) into the aluminum-plastic composite film for vacuum packaging, and repress it in a cold isostatic press. The isostatic pressure is 280MPa. Take it out from the vacuum aluminum-plastic composite film to obtain a composite ...

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Abstract

The invention provides a thin tungsten copper sheet and a preparing method of the thin tungsten copper sheet. The thin tungsten copper sheet is made of tungsten copper dispersed powder through rolling. The thin tungsten copper sheet and the preparing method of the thin tungsten copper sheet overcome the defects of the existing process for preparing the thin tungsten copper sheet. The materials obtained through adopting the preparing method provided by the invention have uniform and compact microscopic structures, the air tightness is qualified, in addition, the production efficiency is high, the material utilization rate is high, and the cost is obviously reduced. The thin tungsten copper sheet prepared by the method provided by the invention conforms to the microelectronic packaging requirements.

Description

technical field [0001] The invention belongs to the field of preparation technology of metal composite materials, and in particular relates to a tungsten-copper sheet and a preparation method thereof. The tungsten-copper sheet prepared by the invention meets the requirements of microelectronic packaging. Background technique [0002] Tungsten-copper alloy is an alloy composed of tungsten and copper. Since tungsten and copper are completely immiscible, it is a two-phase alloy. It has both the high melting point and low thermal expansion coefficient of tungsten, as well as the high thermal conductivity and high electrical conductivity of copper. [0003] With the development of microelectronics technology, the requirements for materials are getting higher and higher. According to the famous Moore's Law, when the price remains constant, the number of transistors that can be accommodated on an integrated circuit will double every 24 months (the popular saying is "doubling every...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F9/24B22F1/00B22F3/00
Inventor 杨义兵苏国平钟铭韩蕊蕊
Owner 安泰天龙钨钼科技有限公司
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