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Method for manufacturing flexible copper-clad plate with metalized through hole

A flexible copper clad laminate and metallized via technology, which is applied in the manufacture of printed circuits, the formation of electrical connection of printed components, and electrical components, etc., can solve the problems of complex process, long process and high cost, and can simplify the process and improve the electrical conductivity. Effect

Inactive Publication Date: 2014-12-17
RICHVIEW ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the existing method for manufacturing flexible copper clad laminates with metallized vias has disadvantages such as complex process, long process, poor conductivity of vias, and high cost.

Method used

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  • Method for manufacturing flexible copper-clad plate with metalized through hole
  • Method for manufacturing flexible copper-clad plate with metalized through hole
  • Method for manufacturing flexible copper-clad plate with metalized through hole

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0032] figure 1 It is an implementation flow chart of the method for manufacturing a flexible copper clad laminate with metalized vias provided by the first embodiment of the present invention. Such as figure 1 As shown, the method provided by the embodiment of the present invention includes:

[0033] Step 101, forming a hole structure on the flexible organic film.

[0034] Figure 2b It is the corresponding structural diagram in this step of the method for manufacturing a flexible copper clad laminate with metalized vias provided by an embodiment of the present invention. Reference Figure 2a with 2b , In such as Figure 2a The flexible organic film 201 shown is formed as Figure 2b The pore structure 211 shown.

[0035] Preferably, the flexible organic film may include: polyimide film, liquid crystal polymer film, polyethylene urea film, polystyrene film, polyethylene terephthalate film, polytetrafluoroethylene Film or polyethylene naphthalate film.

[0036] Preferably, the shape ...

no. 2 example

[0056] image 3 It is an implementation flowchart of a method for manufacturing a flexible copper clad laminate with metalized vias according to the second embodiment of the present invention. Such as image 3 As shown, the method provided by the embodiment of the present invention includes:

[0057] Step 301, forming a hole structure on the flexible organic film.

[0058] Preferably, the flexible organic film may include: polyimide film, liquid crystal polymer film, polyethylene urea film, polystyrene film, polyethylene terephthalate film, polytetrafluoroethylene Film or polyethylene naphthalate film.

[0059] Preferably, the shape of the hole structure is round or square.

[0060] Preferably, the method for forming a hole structure on the flexible organic film is selected from one or more of the following groups: mechanical drilling, punching, laser drilling, and plasma etching.

[0061] Step 302, using a vapor deposition process to form a conductive seed layer on the hole wall of t...

no. 3 example

[0070] Figure 4 It is an implementation flowchart of a method for manufacturing a flexible copper clad laminate with metalized vias provided by the third embodiment of the present invention. Such as Figure 4 As shown, the method provided by the embodiment of the present invention includes:

[0071] Step 401, forming a hole structure on the flexible copper clad board.

[0072] Preferably, the structure for forming holes on the flexible copper clad plate is selected from one or more of the following group: mechanical drilling, punching, laser drilling, plasma etching and reactive ion etching.

[0073] Step 402, using a vapor deposition process to form a conductive seed layer on the hole wall of the hole structure and the surface of the flexible copper clad laminate.

[0074] Compared with the prior art that uses electroless copper plating or black hole processes to form a conductive seed layer, the above solution uses a vapor deposition process to form conductive seeds on the hole wal...

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Abstract

The invention discloses a method for manufacturing a flexible copper-clad plate with a metalized through hole. The method comprises the following steps of forming a hole structure on a flexible organic film; forming conductive seed crystal layers on the wall of the hole structure and the surface of the flexible organic film; and forming metal conductor layers on the conductive seed crystal layers. By the method, the working procedure for manufacturing the flexible copper-clad plate with the metalized through hole can be simplified, and the conductive performance of the metalized through hole in the flexible copper-clad plate is improved.

Description

Technical field [0001] The present invention relates to the technical field of flexible circuit board manufacturing, in particular to a method for manufacturing a flexible copper clad laminate with metalized vias. Background technique [0002] Flexible printed circuit board (Flexible Printed Circuit Board, FPC), also called flexible circuit board, is a printed circuit board with high reliability and flexibility made of flexible copper clad laminate. Flexible Copper Clad Laminate (FCCL) is a copper clad laminate with good flexural properties formed by bonding copper foil of a certain thickness on one or both sides of a flexible organic film. Via is one of the important components of double-layer and multilayer flexible circuit boards. In order to connect the copper layers between the layers of the flexible circuit board, the holes in the flexible circuit board need to be metalized. [0003] The prior art method for manufacturing a flexible copper clad laminate with metalized vias ...

Claims

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Application Information

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IPC IPC(8): H05K3/42
CPCH05K3/426
Inventor 谢新林高明智安兵杨念群
Owner RICHVIEW ELECTRONICS CO LTD
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