Coated copper wire structure for ultrasonic bonding
An ultrasonic and plating technology, applied to electrical components, electrical solid devices, circuits, etc., can solve problems such as poor bonding and difficult to improve the reliability evaluation of the second bonding
Inactive Publication Date: 2017-04-12
TANAKA DENSHI KOGYO KK
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In addition, even if the film thickness is based on the nanometer level, "if the outer layer thickness is less than 20nm, the effect of inhibiting oxidation will be small, so bonding failure will also occur during wedge bonding, and it will be difficult to improve the quality of the second bonding." Reliability Evaluation" (claim 1 and paragraph 0053 of JP-A-2009-140953 Gazette), etc., so far, the plated copper wires are completely isolated from the core material and the atmosphere by coating.
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[0068] With the pure copper alloy wire (copper (Cu) and silver (Ag) are more than 99.9999% by mass percentage purity of composition of core material and plating material shown in Table 1, other alloy components are respectively more than 99.99% by mass percentage purity) After uniform melting and casting, rolling was performed while performing intermediate heat treatment to obtain a thick wire with a diameter of 1 mm. Grooves of sub-µm to several µm are formed on the outer periphery of the thick wire, and a plating material is plated thereon. Then, the wire is continuously drawn through a diamond die by wet method, and finally a 15 μm bonding wire is obtained. The theoretical film thicknesses of the products of Examples 1 to 19 are all 5 nm. In addition, the average diameter reduction rate is 6 to 20%, and the final linear velocity is 100 m / min.
[0069] In addition, the bonding wire used for the second window test and surface morphology imaging of the example products descr...
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Abstract
[Document Name] Abstract [Title of Invention] STRUCTURE OF COATED COPPER WIRE FOR ULTRASONIC BONDING [Object] An object of the present invention is to provide a structure of a coated copper wire which enables stable ultrasonic bonding without independently changing each bonding condition even when a type of a coating material or a core material or a wire diameter of the coated copper wire is changed and has a wide process window width in the ultrasonic bonding. [Configuration] The structure of the present invention is characterized in that: a surface of a core material is provided with a multiple of short streak-like grooves in the form of rings along a longitudinal direction of the wire; and a surface form is such that a coating material comprising a nobler metal or an alloy of the nobler metal having higher oxidization resistance than the core material is coated on the core material. [Selected Drawing] Fig. 1 43
Description
technical field [0001] The present invention relates to a coated copper alloy wire for ultrasonic bonding (ultrasonic bonding) suitable for connecting IC chip electrodes used in semiconductor devices to circuit boards such as external leads, especially in high-temperature environments such as automotive applications, power semiconductors, and high-speed equipment applications. Bonding impacting wires for ultrasonic bonding used below, or copper-plated bonding wires for air-free balls (FAB) that are used even for ultra-fine wires of 15 μm or less. Background technique [0002] Various types of copper wires for connecting IC chip electrodes and external leads of semiconductor devices have been developed. For example, there are pure copper alloy wires that add titanium (Ti) or zirconium (Zr) (JP-A 62-102551), add boron (B) (JP-A-62-102552), and add magnesium (Mg) (JP-A). 62-130248), added rare earth elements (including yttrium (Y)) (JP 62-193254), added calcium (Ca) (JP 62-102...
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IPC IPC(8): H01L23/49C25D7/06
CPCH01L24/43H01L2224/43H01L2224/43848H01L2224/45H01L2224/45014H01L2224/45015H01L2224/45147H01L2224/45565H01L2224/85207H01L2924/181H01L2924/01203H01L2924/00H01L2924/00014H01L2924/00012H01L2924/01046H01L2924/01047H01L2924/01078H01L2924/01079H01L2924/01077H01L2924/01045H01L2924/01022H01L2924/0104H01L2924/0105H01L2924/0103H01L2924/206
Inventor 三上道孝刘斌天野裕之滨本拓也今泉欣之永江祐佳山下勉
Owner TANAKA DENSHI KOGYO KK