Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Chemical processing apparatus

A processing device and liquid medicine technology, which is applied in the manufacture of electrical components, semiconductor/solid-state devices, circuits, etc., can solve problems affecting product costs and reduce the amount of liquid medicine used, so as to increase yield, improve processing efficiency, and suppress defects Effect

Inactive Publication Date: 2014-12-24
SHARP KK
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In order to reduce the manufacturing cost of the display panel, in addition to reducing the unit price of the chemical solution used in the above-mentioned chemical solution treatment, it is also necessary to reduce the amount of chemical solution used, prolong the life of the chemical solution or life count (hereinafter referred to as the chemical solution life), and the above display The increase in the size of the panel and the increase in the number of sheets to be processed, especially the reduction in the amount of chemical solution used and the extension of the life of the chemical solution will lead to long-term factory production and greatly affect product costs.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Chemical processing apparatus
  • Chemical processing apparatus
  • Chemical processing apparatus

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0046] In this Embodiment 1, the etching processing apparatus S is demonstrated as an example of the chemical liquid processing apparatus of this invention.

[0047] The etching apparatus S of this embodiment is used to form patterns of wiring, electrodes, semiconductor layers, etc. on an insulating substrate as a base substrate, for example, when fabricating an active matrix substrate constituting a display panel such as a liquid crystal display device.

[0048] The substrate to be processed (object to be processed) W to be processed by the etching processing apparatus S is, for example, a rectangular flat glass substrate having a size of about 1000 mm to 3200 mm on one side. In addition, the processed substrate W may be the size of one display panel, or may be the size of mother substrates of multiple display panels.

[0049] Configuration of etching processing device S

[0050] figure 1 It is a schematic diagram which shows the schematic structure of the etching proces...

Embodiment approach 2

[0094] Figure 5 It is a schematic diagram showing the internal structure of the etching treatment tank 10 of the second embodiment. In addition, in each of the following embodiments, the etching processing apparatus S has the same configuration as that of the first embodiment except for a part of configuration different from that of the first embodiment. Therefore, only the parts with different configurations will be described, and the same configuration will be transferred to Figure 1 ~ Figure 4 In the description of the first embodiment described above, the detailed description thereof is omitted.

[0095] The etching treatment tank 10 of the present embodiment is configured such that a loading detection sensor 50 for detecting the loading of the substrate W to be processed is provided above the loading port 10a side, and a detection sensor 50 is provided above the loading port 10b side. The carry-out detection sensor 52 that detects the carry-out of the processed substra...

Embodiment approach 3

[0102] The etching processing apparatus S of this Embodiment 3 is provided with the cleaning liquid tank (not shown) which stores a cleaning liquid in addition to the structure of Embodiment 1 mentioned above. This cleaning liquid tank is configured to replace the additive liquid tank 25 or to be connectable to the additive liquid piping 26 . As the cleaning solution, for example, pure water, ionized water, a solution containing a detergent, an acid solution for dissolving crystals of the L component of the etching solution, and the like are used.

[0103] Thus, for example, when it is desired to use a chemical solution different from the etching solution L used so far, or when it is desired to start using the processing device S after it has been stopped, the tank connected to the addition liquid piping 26 is removed from the Adding liquid tank 25 is connected with cleaning liquid tank instead, utilizes the driving of liquid supply pump 27 to make cleaning liquid flow from cl...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A chemical processing apparatus (S) is configured in such a manner that, in a process involving sending a chemical (L) to a shower nozzle (14) via a shower pipe (16) from a chemical tank (12), an additive solution (L2) is supplied to the chemical (L), which flows through the shower pipe (16), via an additive solution pipe (26) from an additive solution tank (25), and, after being supplied to the surface of a substrate being processed (W) from the shower nozzle (14), the chemical (L) is recovered in the chemical tank (12).

Description

technical field [0001] The present invention relates to a chemical solution processing device for performing chemical solution treatment on the surface of a target object such as a display panel, a substrate constituting the display panel, and a semiconductor wafer, and particularly relates to a technology for cost reduction and yield improvement of products. Background technique [0002] In response to the rapid deterioration of display panels in the market in recent years, measures for reducing costs in manufacturing semiconductor wafers and display panels and measures for improving yields are strongly demanded. In particular, as the size of the display panel increases, the manufacturing cost caused by the breakage of each panel continues to increase, and the requirement for reducing the breakage of the display panel becomes stricter. [0003] In the manufacture of a display panel, in processes such as etching treatment and cleaning treatment of the active matrix substrate...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L21/306H01L21/027H01L21/304
CPCH01L21/67017H01L21/67051H01L21/6708H01L21/6776
Inventor 吉安健太朗多比良昌弘山本直义
Owner SHARP KK
Features
  • Generate Ideas
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com