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Multi-sense organ integrated electronic skin and manufacturing method thereof

A technology of electronic skin and integrated electronics, which is applied in the field of machine bionics, can solve the problems of imperfect electronic skin perception function and inaccurate force measurement, and achieve the effects of good elasticity and ductility, short lag time and strong flexibility

Active Publication Date: 2014-12-31
INST OF SEMICONDUCTORS - CHINESE ACAD OF SCI
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AI Technical Summary

Problems solved by technology

[0007] In view of the above technical problems, the present invention proposes a multi-sensory integrated electronic skin to solve the problems of imperfect electronic skin perception function and inaccurate force measurement

Method used

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  • Multi-sense organ integrated electronic skin and manufacturing method thereof
  • Multi-sense organ integrated electronic skin and manufacturing method thereof
  • Multi-sense organ integrated electronic skin and manufacturing method thereof

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Embodiment Construction

[0043] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with specific embodiments and with reference to the accompanying drawings.

[0044] The multi-sensory integrated electronic skin of the present invention can simultaneously detect three kinds of information of the contact force, temperature and distance of the contact object, see figure 1 , the multi-sensory integrated electronic skin of the present invention is composed of several electronic sensory units arranged on a flexible substrate, and the electronic sensory units are arranged in an array. Each electronic sensory unit includes a gate electrode 1, an active semiconductor layer 2, a source electrode 3, a thermistor layer 4 with a negative temperature coefficient, a thermistor layer 5 with a positive temperature coefficient, an elastic microneedle insulating layer 6, a leakage current Pole 7,...

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Abstract

The invention discloses multi-sense organ integrated electronic skin, which consists of a plurality of electronic sense organ units arranged on a flexible substrate; the main body of each electronic sense organ unit is an active field effect transistor taking a resistor as a load and adopting common-source connection, and the force measurement function of a touch sense organ, the temperature measurement function of a temperature sense organ and the distance measurement function of a distance sense organ can be realized simultaneously. The multi-sense organ integrated electronic skin disclosed by the invention is capable of imitating several basic functions of human skin, is good in elasticity and ductility, and can be fitted with the surface of a manipulator to judge and collect a series of physical properties, such as the shape, the size, the material and the hardness, and the temperature and distance information of a target object, and therefore data support and foundation guarantee is provided for a puma manipulator or a robot to complete a series of fine high-difficulty movements.

Description

technical field [0001] The present invention relates to the technical field of machine bionics, and more particularly relates to an electronic skin, especially a multi-sensory integrated electronic skin and a manufacturing method thereof. Background technique [0002] The rapid development of bionic robots has attracted worldwide attention, and more and more intelligent robots have been applied to daily life and medical care, which has attracted a research boom at home and abroad. At present, the robot has the ability to walk and grasp independently, and is equipped with a relatively complete visual and auditory assistance system. In order to make the robot closer to real humans, it is necessary to equip the robot with basic sensory organs. [0003] For robots that perform complex gripping tasks, tactile sensors are indispensable. When performing a grasping action, the robot is required to operate while being able to grasp but not damage the object. Therefore, it is neces...

Claims

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Application Information

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IPC IPC(8): G01L1/00G01K7/22G01V3/08
Inventor 胡晓晖张旭刘鸣裴为华陈弘达
Owner INST OF SEMICONDUCTORS - CHINESE ACAD OF SCI
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