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Ultra-thin continuous winding wave-absorbing material

A wave-absorbing material and ultra-thin technology, applied in the field of wave-absorbing materials, can solve the problems that restrict the development of RFID and NFC technology, the thickness of wave-absorbing materials is large, and the magnetic permeability is not high, so as to meet the large-scale demand of the market and improve the magnetic permeability. Good efficiency and flexibility

Inactive Publication Date: 2015-01-21
JINAN ZHONGZHENG NEW MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] This kind of absorbing material has problems such as large thickness, low magnetic permeability and high surface density, which seriously restrict the development of RFID and NFC technology.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] Embodiment 1 specifically comprises the following steps:

[0027] A. Absorbent heat treatment: Select one of the absorbents, weigh 1Kg of the absorbent, put it into the inner cavity of the muffle furnace, pass the protective gas, heat it to 400°C within 2 hours, keep it warm for 0.5 hours, and then cool down naturally, the temperature is lower than Turn off the protective gas at 40°C, take it out after the temperature reaches room temperature, and prepare an absorbent with a magnetic permeability of 100.

[0028] B. Select one of polymer materials such as rubber, plastic and thermoplastic elastomer as the matrix material.

[0029] C. Mixing: According to the mass ratio of absorbent: polymer matrix material = 1: 1, use an internal mixer to fully masticate to obtain a mixed rubber;

[0030] D. Tablet pressing: Use an open mill to press the mixed rubber out of a sheet with a thickness of 0.5mm;

[0031] E. Calendering and winding: Put the sheets obtained in step C into t...

Embodiment 2

[0036] Embodiment 2 specifically comprises the following steps:

[0037] A. Absorbent heat treatment: Select the absorbent, weigh 5Kg of the absorbent, put it into the inner cavity of the muffle furnace, pass the protective gas, heat to 450°C within 4h, keep it warm for 0.5h, then cool down naturally, and close the protection when the temperature is lower than 40°C gas, and take it out after the temperature reaches room temperature to prepare an absorbent with a magnetic permeability of 120.

[0038] B. Select one of polymer materials such as rubber, plastic and thermoplastic elastomer as the matrix material.

[0039] C. Mixing: according to the mass ratio of absorbent: polymer matrix material = 9: 1, use an open mill to fully masticate to obtain a mixed rubber;

[0040] D. Tablet pressing: Use an open mill to press the mixed rubber out of a sheet with a thickness of 0.5mm;

[0041] E. Calendering and winding: Put the sheets obtained in step C into the calender in turn to ob...

Embodiment 3

[0046] Embodiment 3 specifically comprises the following steps:

[0047] A. Absorbent heat treatment: select absorbent, weigh 3Kg of absorbent, put it into the inner cavity of muffle furnace, pass protective gas, heat to 430°C within 3.5h, keep warm for 0.5h, then cool down naturally, and shut down when the temperature is lower than 40°C The protective gas is taken out after the temperature reaches room temperature, and an absorbent with a magnetic permeability of 80 is prepared.

[0048] B. Two kinds of polymer materials such as rubber, plastic and thermoplastic elastomer are selected as the matrix material.

[0049] C. Mixing: According to the mass ratio of absorbent: polymer matrix material = 6: 1, use an internal mixer to fully masticate to obtain a mixed rubber;

[0050] D. Tablet pressing: Use an open mill to press the mixed rubber out of a sheet with a thickness of 0.5mm;

[0051] E. Calendering and winding: put the sheets obtained in step C into the calender in turn ...

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PUM

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Abstract

The invention discloses an ultra-thin continuous winding wave-absorbing material. The wave-absorbing material is prepared by the following steps: A, preparing an absorbent: carrying out annealing treatment on an alloy material, wherein the alloy material is one or more of an iron-nickel alloy flake powder, an iron-cobalt alloy flake powder, an iron-silicon-aluminum alloy flake powder or a carbonyl iron flake powder; B, selecting one or more of rubber, plastics or a thermoplastic elastomer polymer material as a base material; C, mixing: mixing according to the 1-9 mass ratio of the absorbent to the polymer base material to obtain a mixed compound; D, preforming: pressing the mixed compound into sheets with the thickness less than 0.5 mm; E, rolling and winding: successively and continuously putting the sheets obtained in step D in a calender to obtain the wave-absorbing material with the thickness less than 0.3 mm. The wave-absorbing material has a high-permeability real part and a low-permeability imaginary part at the frequency point of 13.56 MHz, is simple in manufacturing technique and easy to cut and use, and is mainly applied to high-frequency metal-resistant electronic tags and mobile payment.

Description

technical field [0001] The invention relates to an electromagnetic wave absorbing material, which is a wave absorbing material used in the anti-interference field of RFID and NFC high-frequency electronic tags. Background technique [0002] Radio frequency identification technology (RFID) is a technology that uses radio frequency signals to achieve non-contact information transmission through spatial coupling and achieve identification purposes through the transmitted information. A set of RFID system includes electronic tags, readers and antennas. Currently, the working frequency of RFID products is defined as low frequency, high frequency and ultra-high frequency ranges. RFID products in different frequency bands will have different characteristics. High-frequency electronic tag identification Due to the advantages of short distance, low price, good confidentiality and large amount of data carried by the tag, it has been widely used. [0003] NFC near-field communication ...

Claims

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Application Information

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IPC IPC(8): C08L7/00C08L83/04C08L23/06C08L23/12C08L23/00C08L75/04C08L101/02C08K9/00C08K3/08C08K3/34C08K3/18B29C69/00
CPCC08K9/00C08K3/02C08K3/08C08K2003/023C08K2003/0843C08K2003/0856C08K2003/0862C08K2003/2227C08K2201/014C08L7/00C08L23/00C08L23/06C08L23/12C08L75/04C08L83/04C08L2205/03C08L2205/035C08L2207/04C08L101/02C08K3/18C08K3/00
Inventor 李昌林
Owner JINAN ZHONGZHENG NEW MATERIAL
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