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Low-temperature curing conductive silver paste and preparation method thereof

A technology of conductive silver paste and low temperature, which is applied in the manufacture of cables/conductors, conductive materials dispersed in non-conductive inorganic materials, circuits, etc., can solve the problems of insufficient adhesion and hardness of conductive silver paste, and achieve adhesion and hardness excellent effect

Active Publication Date: 2015-02-04
SHENZHEN SILMAC NEW MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is to provide a low-temperature curing conductive silver paste for the defects of insufficient adhesion and hardness of the conductive silver paste in the prior art

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] Silver powder: bulk density 0.8-1.7g / ml; tap density 2.5-3.5g / ml, average particle size 1.0-4.0um; specific surface area less than 2m 2 / g; the burning loss rate (550°C, 0.5h) is less than 1%; the silver purity is above 99.95%.

[0044] Epoxy resin oligomer: It mainly contains 15-25% isocyanate, 0.5-5% imidazole epoxy curing agent, and 70-80% epoxy resin. The three are mixed and reacted at 70-120°C for 0.5-4h. , the epoxy resin oligomer accounts for 25-35% by weight of the silver paste system.

[0045] Solvent: one of isophorone, naphtha, diethyl ether acetate dioxalate, diethyl adipate, diethyl ether acetate oxalate, butyl ether acetate oxalate, DBE, in silver paste The weight ratio in the system is 5-10%.

[0046] Curing agent: one of isocyanate, imidazole and dicyandiamide, the weight percentage is 0.1-5% of the system.

[0047] The polymer resin carrier is high molecular weight polyurethane resin with excellent mechanical properties, molecular weight greater than...

Embodiment 2

[0065] Silver powder: bulk density 0.8-1.7g / ml; tap density 2.5-3.5g / ml, average particle size 1.0-4.0um; specific surface area less than 2m 2 / g; the burning loss rate (550°C, 0.5h) is less than 1%; the silver purity is above 99.95%.

[0066] Epoxy resin oligomer: It mainly contains isocyanate 15-25%, imidazole epoxy curing agent 0.5-5%, epoxy resin 70-80%, and the three are mixed and reacted at 70-120℃ for 0.5-4h. , the epoxy resin oligomer accounts for 25-35% by weight of the silver paste system.

[0067] Solvent: One of isophorone, naphtha, diethyl ether acetate dioxalate, diethyl adipate, diethyl ether acetate oxalate, butyl ether acetate oxalate, DBE, in silver paste The weight ratio in the system is 5-10%.

[0068] Curing agent: one of isocyanate, imidazole and dicyandiamide, the weight percentage is 0.1-5% of the system.

[0069] The polymer resin carrier is high molecular weight polyurethane resin with excellent mechanical properties, molecular weight greater than 10...

Embodiment 3

[0087] Silver powder: bulk density 0.8-1.7g / ml; tap density 2.5-3.5g / ml, average particle size 1.0-4.0um; specific surface area less than 2m2 / g; burning loss rate (550°C, 0.5h) less than 1 %; Silver purity over 99.95%.

[0088] Epoxy resin oligomer: It mainly contains isocyanate 15-25%, imidazole epoxy curing agent 0.5-5%, epoxy resin 70-80%, and the three are mixed and reacted at 70-120℃ for 0.5-4h. , the epoxy resin oligomer accounts for 25-35% by weight of the silver paste system.

[0089] Solvent: One of isophorone, naphtha, diethyl ether acetate dioxalate, diethyl adipate, diethyl ether acetate oxalate, butyl ether acetate oxalate, DBE, in silver paste The weight ratio in the system is 5-10%.

[0090] Curing agent: one of isocyanate, imidazole and dicyandiamide, the weight percentage is 0.1-5% of the system.

[0091] The polymer resin carrier is high molecular weight polyurethane resin with excellent mechanical properties, molecular weight greater than 100,000, glass t...

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Abstract

Low-temperature curing conductive silver paste comprises, in weight percent, 60-80% of silver powder, 5-20% of polymer resin carriers, 5-20% of epoxy resin low polymer, 5-10% of solvents and 0.1-5% of curing agents. A method for preparing the conductive silver paste includes the steps: firstly, preparing pre-polymer; secondly, preparing diffusers; thirdly, preparing precursor; finally, adding the silver powder into a stirring box, mixing the silver powder and then grinding and filtering the mixture to obtain the conductive silver paste. The low-temperature curing conductive silver paste can achieve low-temperature curing effects, and has excellent adhesive force and hardness.

Description

technical field [0001] The invention relates to a low-temperature curing conductive paste and a preparation method thereof. Background technique [0002] At present, the electronics industry is developing by leaps and bounds, and conductive silver paste is an important functional material for the preparation of electronic components. The current conductive paste is mainly divided into membrane switch, capacitive screen, resistive screen, and solar paste. According to the curing conditions, it is divided into low-temperature curing silver paste, medium-temperature curing silver paste, and high-temperature sintering silver paste. The conductive silver paste for touch screen is mainly low-temperature curing silver paste. The low-temperature curing silver paste must first meet the requirements of low temperature curing, and after curing, the conductivity, adhesion, hardness and environmental stability meet the requirements. [0003] At present, most of the low-temperature curin...

Claims

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Application Information

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IPC IPC(8): H01B1/22H01B13/00
Inventor 赵曦刘高君张红艳王沙生赵刚
Owner SHENZHEN SILMAC NEW MATERIAL
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