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A kind of low temperature curing conductive silver paste and preparation method thereof

A technology of conductive silver paste and low temperature, which is applied in the manufacture of cables/conductors, conductive materials dispersed in non-conductive inorganic materials, circuits, etc., can solve the problems of insufficient adhesion and hardness of conductive silver paste, and achieve adhesion and hardness excellent effect

Active Publication Date: 2017-01-04
SHENZHEN SILMAC NEW MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is to provide a low-temperature curing conductive silver paste for the defects of insufficient adhesion and hardness of the conductive silver paste in the prior art

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] Silver powder: bulk density 0.8-1.7g / ml; tap density 2.5-3.5g / ml, average particle size 1.0-4.0um; specific surface area less than 2m 2 / g; burning loss rate (550℃, 0.5h) is less than 1%; silver purity is above 99.95%.

[0044] Epoxy resin oligomer: mainly contains 15-25% isocyanate, 0.5-5% imidazole epoxy curing agent, 70-80% epoxy resin, and the three are mixed and reacted at 70-120℃ for 0.5-4h. The epoxy resin oligomer accounts for 25-35% by weight of the silver paste system.

[0045] Solvent: one of isophorone, naphtha, dioxal ether acetate, diethyl adipate, oxalate ethyl ether acetate, butyl oxalate acetate, DBE, in silver paste The weight ratio in the system is 5-10%.

[0046] Curing agent: one of isocyanate, imidazole, dicyandiamide, the weight percentage is 0.1-5% of the system.

[0047] The polymer resin carrier is a high molecular weight polyurethane resin with excellent mechanical properties, the molecular weight is greater than 100000, and the glass transition temp...

Embodiment 2

[0065] Silver powder: bulk density 0.8-1.7g / ml; tap density 2.5-3.5g / ml, average particle size 1.0-4.0um; specific surface area less than 2m 2 / g; burning loss rate (550℃, 0.5h) is less than 1%; silver purity is above 99.95%.

[0066] Epoxy resin oligomer: mainly contains 15-25% isocyanate, 0.5-5% imidazole epoxy curing agent, 70-80% epoxy resin, and the three are mixed and reacted at 70-120℃ for 0.5-4h. The epoxy resin oligomer accounts for 25-35% by weight of the silver paste system.

[0067] Solvent: one of isophorone, naphtha, dioxal ether acetate, diethyl adipate, oxalate ethyl ether acetate, butyl oxalate acetate, DBE, in silver paste The weight ratio in the system is 5-10%.

[0068] Curing agent: one of isocyanate, imidazole, dicyandiamide, the weight percentage is 0.1-5% of the system.

[0069] The polymer resin carrier is a high molecular weight polyurethane resin with excellent mechanical properties, the molecular weight is greater than 100000, and the glass transition temp...

Embodiment 3

[0087] Silver powder: loose density 0.8-1.7g / ml; tap density 2.5-3.5g / ml, average particle size 1.0-4.0um; specific surface area less than 2m2 / g; burning loss rate (550℃, 0.5h) less than 1 %; Silver purity is above 99.95%.

[0088] Epoxy resin oligomer: mainly contains 15-25% isocyanate, 0.5-5% imidazole epoxy curing agent, 70-80% epoxy resin, and the three are mixed and reacted at 70-120℃ for 0.5-4h. The epoxy resin oligomer accounts for 25-35% by weight of the silver paste system.

[0089] Solvent: one of isophorone, naphtha, dioxal ether acetate, diethyl adipate, oxalate ethyl ether acetate, butyl oxalate acetate, DBE, in silver paste The weight ratio in the system is 5-10%.

[0090] Curing agent: one of isocyanate, imidazole, dicyandiamide, the weight percentage is 0.1-5% of the system.

[0091] The polymer resin carrier is a high molecular weight polyurethane resin with excellent mechanical properties, the molecular weight is greater than 100000, and the glass transition temper...

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Abstract

A low-temperature curing conductive silver paste, the conductive silver paste is made of the following components in mass percentage: silver powder: 60-80; polymer resin carrier: 5-20; epoxy resin oligomer: 5-20 ; Solvent: 5-10; Curing agent: 0.1-5. A method for preparing conductive silver paste, comprising the following steps: firstly prepare a prepolymer, then prepare a dispersion, then prepare a precursor, and finally add silver powder into a stirring box, mix, grind, and filter to obtain a conductive silver paste . The low-temperature curing conductive silver paste of the present invention can achieve a low-temperature curing effect, and has excellent specific adhesion and hardness.

Description

Technical field [0001] The invention relates to a low-temperature curing conductive paste and a preparation method thereof. Background technique [0002] At present, the electronics industry is developing by leaps and bounds, and conductive silver paste is an important functional material for the preparation of electronic components. The current conductive pastes are mainly divided into membrane switches, capacitive screens, resistive screens, and solar pastes. According to the curing conditions, it is divided into low-temperature curing silver paste, medium-temperature curing silver paste, and high-temperature sintering silver paste. The conductive silver paste for touch screens is mainly low-temperature curing silver paste. Low-temperature curing silver paste must first meet the requirements of low-temperature curing, and the conductivity, adhesion, hardness, and environmental stability after curing. [0003] At present, most of the low-temperature curing silver pastes used for ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01B1/22H01B13/00
Inventor 赵曦刘高君张红艳王沙生赵刚
Owner SHENZHEN SILMAC NEW MATERIAL
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