Wave-absorbing material, wave-absorbing substrate and manufacturing method

A technology of wave absorbing materials and substrates, applied in the field of wave absorbing materials, can solve the problems of low mechanical strength of wave absorbing materials and complex thickness of wave absorbing layers, etc.

Active Publication Date: 2015-02-11
KUANG CHI INST OF ADVANCED TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The mechanical strength of the wave-absorbing material prepared by this method is low, and its use in many special fields has great limitations; and changing the thickness of the wave-absorbing layer is also more complicated

Method used

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  • Wave-absorbing material, wave-absorbing substrate and manufacturing method
  • Wave-absorbing material, wave-absorbing substrate and manufacturing method
  • Wave-absorbing material, wave-absorbing substrate and manufacturing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0068] The wave-absorbing substrate is obtained by impregnating the para-aramid paper used as a reinforcing material sheet into the resin-based wave-absorbing material, and then at least heating the para-aramid paper, such as a baking process. Among them, the resin-based absorbing material is configured according to the following ratio:

[0069] Hongchang Electronic Materials Co., Ltd. model GEBR454A80 epoxy resin (solid content 80%, 20% acetone solvent) 125g

[0070] Taiwan Changchun Petroleum Resin Material Co., Ltd. model PF8090M62 phenolic resin (62% solid content, 38% acetone solvent) 40g

[0071] Carbonyl iron powder 203g

[0072] Acetone 40g

[0073] Wherein, the ratio of the phenolic hydroxyl equivalent of the phenolic resin to the epoxy equivalent of the epoxy resin is 1:1.

[0074] Preparation method: Stir epoxy resin, phenolic resin, carbonyl iron powder and acetone evenly to make a glue (for example, stir for about 2 hours); use Haotian Longbang's 0.05mm para-ar...

Embodiment 2

[0077] The wave-absorbing substrate is obtained by impregnating the para-aramid paper used as a reinforcing material sheet into the resin-based wave-absorbing material, and then at least heating the para-aramid paper, such as a baking process. Among them, the resin-based absorbing material is configured according to the following ratio:

[0078] Hongchang Electronic Materials Co., Ltd. model GEBR454A80 epoxy resin (solid content 80%, 20% acetone solvent) 125g

[0079] Taiwan Changchun Petroleum Resin Material Co., Ltd. model PF8090M62 phenolic resin (62% solid content, 38% acetone solvent) 40g

[0080] Carbonyl iron powder 253g

[0081] 1,2-Dimethylimidazole 0.0625g

[0082] Acetone 40g

[0083] Wherein, the ratio of the phenolic hydroxyl equivalent of the phenolic resin to the epoxy equivalent of the epoxy resin is 1:1.

[0084] Preparation method: Stir epoxy resin, phenolic resin, carbonyl iron powder and acetone evenly, add dimethylimidazole and stir to make a glue (for...

Embodiment 3

[0087] The wave-absorbing substrate is obtained by impregnating the para-aramid paper used as a reinforcing material sheet into the resin-based wave-absorbing material, and then at least heating the para-aramid paper, such as a baking process. Among them, the resin-based absorbing material is configured according to the following ratio:

[0088] Hongchang Electronic Materials Co., Ltd. model is GEBR454A80 epoxy resin (80% solid content, 20% acetone solvent) 125g

[0089] Taiwan Changchun Petroleum Resin Material Co., Ltd. model is PF8090M62 phenolic resin (62% solid content, 38% acetone solvent) 40g

[0090] Carbonyl iron powder 374g

[0091] 1,2-Dimethylimidazole 0.0625g

[0092] Acetone 40g

[0093] The ratio of the phenolic hydroxyl equivalent of the phenolic resin to the epoxy equivalent of the epoxy resin is 1:1.

[0094] Preparation method: Stir epoxy resin, phenolic resin, carbonyl iron powder and acetone evenly, add dimethylimidazole and stir to make a glue (for ex...

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Abstract

The invention discloses a wave-absorbing material with high wave-absorbing performance. The wave-absorbing material comprises the following components in parts by weight: 100 parts of epoxy resin, 23-26 parts of a curing agent, 200-400 parts of carbonyl iron powder and 40-100 parts of an organic solvent, wherein the curing agent is phenolic resin, anhydride resin, amine resin or a mixture thereof; and the organic solvent is acetone, butanone, propanol methyl ether or a mixture thereof. The invention further discloses a manufacturing method of a wave-absorbing material substrate.

Description

technical field [0001] The invention relates to the technical field of wave-absorbing materials, and more specifically, to an epoxy resin composite wave-absorbing material, a wave-absorbing substrate and a preparation method thereof. Background technique [0002] Absorbing material is an important functional composite material, which was first used in military, which can reduce the radar cross section of military targets. With the development of science and technology, electronic components are increasingly integrated, miniaturized and high-frequency, and microwave-absorbing materials are more and more widely used in civil fields, such as microwave anechoic chamber materials, micro-attenuator components and microwave molding processing technology, etc. . How to integrate absorbing materials into existing composite materials and structures has become a major challenge in material preparation. [0003] Absorbing materials are usually composite materials made by mixing matrix...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L63/02C08L63/04C08K3/18C08K5/3445C09K3/00B32B27/04B32B27/38B32B3/24B32B37/06B32B38/04
Inventor 不公告发明人
Owner KUANG CHI INST OF ADVANCED TECH
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