A tail gas treatment device for a decompression diffusion system

An exhaust gas treatment and exhaust gas technology, which is applied in the directions of post-treatment, waste heat treatment, diffusion/doping, etc., can solve the problems affecting the service life of vacuum pumps, damage of vacuum pumps, air pollution, etc. Corrosion reduction effect

Inactive Publication Date: 2017-03-29
48TH RES INST OF CHINA ELECTRONICS TECH GROUP CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The vacuum pump is the key component of the decompression diffusion furnace. Because the temperature of the gas is very high when it is first exported from the quartz reaction tube, and it is highly acidic and corrosive, the exhaust gas directly entering the vacuum pump will easily cause corrosion of the parts in the vacuum pump and affect the service life of the vacuum pump. In severe cases, the vacuum pump will be damaged. In addition, the untreated high-temperature acid corrosive gas is directly pumped out through the vacuum pump and discharged to the outside world, which will cause air pollution.

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  • A tail gas treatment device for a decompression diffusion system
  • A tail gas treatment device for a decompression diffusion system
  • A tail gas treatment device for a decompression diffusion system

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specific Embodiment approach

[0032] The specific implementation manners of the present invention will be described below in conjunction with the accompanying drawings.

[0033] Such as Figure 1-Figure 6 As shown, a tail gas treatment device for a decompression diffusion system of the present invention consists of a quartz reaction tube 1, a tail gas outlet pipe 2 placed at the bottom of the quartz reaction tube, a tail gas condensation device 3, a tail gas neutralization bottle 4, and a vacuum pump 5 , connecting pipes and joints 6 and so on. The connection relationship of each component in the device is: the tail gas outlet pipe 2 of the quartz reaction tube 1 is connected with the inlet port 31 of the tail gas condensing device 3, the exhaust port 32 of the tail gas condensing device 3 is connected with the inlet port of the tail gas neutralization bottle 4 41 is connected, and the exhaust port 42 of the tail gas neutralization bottle 4 is connected with the vacuum pump 5, that is, the tail gas conden...

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Abstract

The invention discloses a tail gas treating device for a reduced-pressure diffusion system. The device comprises a quartz reaction tube (1) for receiving tail gas output by the reduced-pressure diffusion system, wherein a tail gas leading-out tube (2) is arranged at the bottom of the quartz reaction tube and connected with a vacuum pump (5) for pumping the tail gas outwards through a tail gas condensation device (3) and a tail gas neutralization bottle (4). According to the device, cooling, gas-liquid separation and collection of tail gas metaphosphoric acid are finished through the tail gas condensation device, and residual acidic components in the tail gas are further neutralized through the tail gas neutralization bottle, so that the tail gas of the reduced-pressure diffusion system can be treated efficiently and conveniently, on one hand, the effect caused by the high-temperature corrosive tail gas on the vacuum pump can be substantially reduced, the service life and the maintenance period of the vacuum pump are prolonged, and on the other hand, the tail gas is cleaner and more environment-friendly when emitted after treated.

Description

technical field [0001] The invention relates to a tail gas treatment device of a decompression diffusion system used in electronic semiconductor technology, especially in the field of special equipment for the production of crystalline silicon solar cells, and is used for condensing and neutralizing the high-temperature acid tail gas of the decompression diffusion system. Background technique [0002] The main purpose of the diffusion furnace is to dope the semiconductor wafer under high temperature conditions, that is, to diffuse elements phosphorus and boron into the silicon wafer, so as to change and control the type, concentration and distribution of impurities in the semiconductor, so as to establish regions with different electrical characteristics. In the solar photovoltaic industry, the diffusion furnace is used to prepare the PN junction of solar cells. The quality of the diffusion PN junction has an important impact on the conversion efficiency of solar cells and is...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C30B31/16F27D17/00
Inventor 刘良玉陈晖张宝锋闫海莲曹骞
Owner 48TH RES INST OF CHINA ELECTRONICS TECH GROUP CORP
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