A method for improving the gap of aluminum strips in integrated circuit thick aluminum evaporation coating process
An evaporation coating and integrated circuit technology, which is applied in the manufacture of circuits, electrical components, semiconductors/solid-state devices, etc., can solve problems such as voids in the aluminum layer, achieve high mobility, improve voids, and improve the effect of voids in the aluminum layer
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[0021] In order to further illustrate the present invention, through the comparison of the traditional pure aluminum process and the aluminum alloy process of the present invention, the improvement of the thick aluminum gap by the optimized aluminum alloy process is illustrated in conjunction with the accompanying drawings. Specific steps are as follows:
[0022] Step 1, completing the front lead hole etching process.
[0023] Explanation: The dielectric under the metal layer is generally an oxide layer or silicon nitride, such as the dielectric layer I in the figure.
[0024] Step 2, depositing a 2.5um metal layer.
[0025] In order to describe the specific implementation mode and effect of the present invention more practically, the MARK50 evaporation platform of CHA Industries Company was selected as the experimental machine. The machine adopts typical parameter settings, the cavity vacuum is 1.0E-6Torr, the substrate temperature is 130°C, and the evaporation rate is 20A / ...
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