Copper or copper alloy chemical polishing liquid and preparation method thereof

A chemical polishing and copper alloy technology, applied in the field of chemical polishing liquid and its preparation, can solve the problems of increasing production cost and sewage treatment cost, shortening the service life of chemical polishing liquid, unstable hydrogen peroxide, etc., so as to achieve easy control of the corrosion process , chemical polishing quality is stable, and the surface of parts is uniform

Inactive Publication Date: 2015-03-25
贵州振华群英电器有限公司(国营第八九一厂)
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, only a special polishing process can be used for different copper or copper alloy materials.
In the production process of each batch of parts, the production volume of parts of the same material is small, but there are many types of materials, which greatly reduces production efficiency and increases production costs and sewage treatment costs.
Not only that, but the current copper or alloy chemical polishing solution contains a large amount of volatile hydrochloric acid and nitric acid, which is more serious to air pollution.
Although some chemical polishing solutions for copper and alloys use hydrogen peroxide instead of hydrochloric acid and nitric acid, which is pollution-free, and the effect of chemical polishing is also very good, but hydrogen peroxide is unstable, especially for metals such as copper dissolved in the polishing process. Ions have a strong catalytic effect on the decomposition of hydrogen peroxide. Even if a stabilizer is added to the polishing liquid, the hydrogen peroxide will be violently decomposed to make the polishing liquid invalid, which shortens the service life of the chemical polishing liquid and increases the production cost.

Method used

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  • Copper or copper alloy chemical polishing liquid and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] Example 1. 1 liter of copper or copper alloy chemical polishing solution, take 300-600ml of 92.5-98wt% concentrated sulfuric acid, 15-60ml of 50-70wt% nitric acid, 1-10g of phenylproprazole, dodecyl sulfuric acid Sodium 5~40g, OP emulsifier 5~35ml, sodium nitrite 0.5~5g and enough water are prepared according to the following steps:

[0020] a. Measure 350ml of water to obtain product A;

[0021] b. Slowly add 300-600 ml of concentrated sulfuric acid with 92.5-98wt% sulfuric acid to product A while stirring, and wait until the temperature drops to 50-60°C to obtain product B;

[0022] c. Slowly add 15-60ml of 50-70wt% nitric acid to product B and stir continuously to obtain product C;

[0023] d. Add 1-10 g of phenylproprazole to product C under stirring to obtain product D;

[0024] e. Add 5-40g of sodium lauryl sulfate into product D under stirring to obtain product E;

[0025] f. Add 5~35ml OP emulsifier to product E under stirring to obtain product F;

[0026] g. Add 0.5~5g of...

Embodiment 2

[0028] Example 2. 1 liter of copper or copper alloy chemical polishing liquid, take 400-500ml of 92.5-98wt% concentrated sulfuric acid, 25-50ml of 50-70wt% nitric acid, 3-5g of phenylproprazole, dodecyl sulfuric acid Sodium 10~30g, OP emulsifier 10~20ml, sodium nitrite 0.5~1.5g and sufficient water are prepared according to the steps of Example 1.

Embodiment 3

[0029] Example 3. 1 liter of copper or copper alloy chemical polishing liquid, take 350ml of 92.5~98wt% concentrated sulfuric acid, 35ml of 50~70wt% nitric acid, 4g phenyltriazole, 20g sodium lauryl sulfate, OP emulsifier 15ml, 1g sodium nitrite and enough water are prepared according to the steps of Example 1.

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PUM

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Abstract

The invention discloses a copper or copper alloy chemical polishing liquid which is prepared from 300-600ml / L of 92.5-98wt% concentrated sulfuric acid, 15-60ml / L of 50-70wt% nitric acid, 1-10g / L of benzotriazole methyl, 5-40g / L of lauryl sodium sulfate, 5-35ml / L of an OP emulsifier, 0.5-5g / L of sodium nitrite and the balance of water. The copper or copper alloy chemical polishing liquid disclosed by the invention is relatively simple in component, easy to operate and relatively small in atmosphere pollution. A component which is polished by using the chemical polishing liquid is uniform in surface, stable in chemical polishing quality and not easy to over-corrode, the production efficiency is greatly improved, and the production cost is lowered.

Description

Technical field [0001] The invention relates to a chemical polishing liquid and a preparation method thereof, in particular to a copper or copper alloy chemical polishing liquid and a preparation method thereof. Background technique [0002] At present, many professional manufacturers specializing in the production of relays produce more parts made of copper or copper alloy materials, but there has been no general bright etching solution process. Therefore, for different copper or copper alloy materials, only a special polishing process can be used. In the production process of each batch of parts, the production volume of parts of the same material is small, but the types of materials are large, which greatly reduces production efficiency, and increases production costs and sewage treatment costs. Not only that, the current chemical polishing liquid for copper or alloy contains a large amount of volatile hydrochloric acid and nitric acid, which causes serious air pollution. Al...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23F3/06
Inventor 沈国文罗毅吴华强王李涛
Owner 贵州振华群英电器有限公司(国营第八九一厂)
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