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Method and device for magnetic particle induced laser plasma etching insulating transparent material

A transparent material and plasma technology, applied in laser welding equipment, welding equipment, metal processing equipment, etc., can solve problems such as complex operation, high cost of high-power lasers, thermal cracking of glass, etc., achieve high output frequency, realize processing efficiency, The effect of reducing power requirements

Inactive Publication Date: 2016-04-06
JIANGSU UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, high-power lasers are costly and complicated to operate, and high-power lasers will generate a lot of heat when used, which is likely to cause thermal cracking defects in glass, which restricts its processing application

Method used

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  • Method and device for magnetic particle induced laser plasma etching insulating transparent material
  • Method and device for magnetic particle induced laser plasma etching insulating transparent material

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Embodiment Construction

[0034] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments, but the protection scope of the present invention is not limited thereto.

[0035] Such as figure 1 As shown, the device for etching insulating and transparent materials by magnetic particle-induced laser plasma in the present invention includes a laser output device, a beam transmission system, and a laser etching processing system. The laser output device is a nanosecond pulse laser, the wavelength of the output pulse laser is 1064 nanometers, the pulse time is 10 nanoseconds, the frequency is 10-100 Hz, the laser energy is 1 Joule, and the laser spot mode is selected from basement film or multimode. The beam transmission system is located on the laser optical path and includes an adjustable mirror and an adjustable focusing lens. The laser beam emitted by the laser is focused on the glass surface through the beam modulation and transmission sy...

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Abstract

The invention provides a method and device for magnetic powder-induced laser plasma etching insulating transparent materials. The method uses magnetic powder as an absorbing layer to absorb laser energy, so that the energy is mainly irradiated on the solution / material interface, thereby striking Plasma is generated by penetrating the solution, forming impact stress and cavitation stress, which act on the surface of insulating and transparent materials to achieve material removal. It reduces the laser power requirements for the etching process of workpieces processed by insulating transparent materials, improves the processing efficiency, and avoids the defect that the workpieces processed by high-energy laser processing insulating and transparent materials are prone to fragmentation.

Description

technical field [0001] The invention belongs to the field of material microprocessing, in particular to a method and a device for magnetic powder induced laser plasma etching insulating transparent materials. Background technique [0002] Due to the excellent properties of high intensity, high brightness, stable wavelength and frequency, good monochromaticity, good coherence, long coherence length and good directionality, the laser has been widely used in the field of industrial processing. [0003] During laser processing, once the laser light is incident on the surface of the processed sample, the surface will absorb and reflect the laser light. This absorption and reflection mainly depends on the optical properties of the sample surface. The surface of the sample absorbs the laser energy, making its surface temperature rise, which can change the structure and performance of the surface tissue of the sample, and even cause irreversible damage. This phenomenon has been wid...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/348
CPCB23K26/18B23K26/356B23K26/1224B23K26/361B23K26/362B23K26/348
Inventor 张朝阳黄磊姜雨佳冯钦玉蔡明霞佟艳群刘皋陆海强
Owner JIANGSU UNIV
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