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High-power white light LED with good heat dissipation and manufacturing method thereof

A manufacturing method and high-power technology, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of low thermal stability of mixed organic glue materials, uneven angular distribution of white light correlated color temperature, and yellow circles. Taking into account heat transfer and heat storage capacity, eliminating edge chromatic aberration effect, and increasing the effective output of light

Active Publication Date: 2017-06-16
FUJIAN CAS CERAMIC OPTOELECTRONICS TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, there are also the following problems: 1. The dispersion uniformity of the phosphor particles in the organic material is poor, so that the optical uniformity of the white LED device is affected; 3. The thermal stability of the organic rubber material used for mixing is not high, and there is aging and degradation; 4. The thermal conductivity and heat dissipation performance of the phosphor powder coating is poor, which may easily cause temperature quenching and aging of the phosphor powder, resulting in a decrease in luminous efficiency ;5. Because the thickness of the coating is difficult to control when it is coated on the surface of the chip, the angular distribution of the correlated color temperature of white light is uneven, resulting in yellow circles around the white light source.
LED is a heat-sensitive element. If the heat generated at the chip cannot be dissipated in time, it will cause the junction temperature to rise and affect its working performance, which will cause the following series of problems: 1. The luminous intensity decreases, and the luminous efficiency of the chip increases with the junction temperature. 2. The emission spectrum of the chip is red-shifted, resulting in a decrease in light conversion efficiency; 3. The life of the product is greatly shortened

Method used

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  • High-power white light LED with good heat dissipation and manufacturing method thereof
  • High-power white light LED with good heat dissipation and manufacturing method thereof
  • High-power white light LED with good heat dissipation and manufacturing method thereof

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Embodiment Construction

[0038] Such as Figure 1 to Figure 5 As shown, the high-power white LED with good heat dissipation of the present invention includes a COB chip module 1 , a transparent ceramic fluorescent cover 2 , a reflector 4 , an upper liquid-filled cavity 31 , a lower liquid-filled cavity 32 and a radiator 6 .

[0039] Such as figure 1 and figure 2 As shown, the COB chip module 1 is a heat dissipation substrate 12 packaged with multiple blue LED chips 11; wherein, the blue LED chips 11 of the present invention can reach more than 100, which can realize real high power; the COB chip The module 1 is located at the bottom of the reflective cup 4 and has a liquid outlet 14 in the middle; the positive and negative electrodes 13 of the COB chip module 1 are electrically connected to the external positive and negative electrodes respectively. In a preferred embodiment, the blue LED chips 11 packaged on the COB chip module 1 are arranged in an array structure, such as a circular array, and co...

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Abstract

The invention provides a high-power white-light LED (Light-emitting Diode) excellent in heat radiation and a manufacturing method of the high-power white-light LED. The high-power white-light LED excellent in heat radiation comprises a COB (Chip On Board) module, a transparent ceramic fluorescent cover plate, a reflection cup, an upper liquid-filled cavity, a lower liquid-filled cavity and a heat radiator, wherein the COB module is a heat radiation substrate encapsulated with a plurality of blue light LED chips, and is located on the bottom part of the reflection cup; the transparent ceramic fluorescent cover plate is located above the COB module and is fixed on the reflection cup through sealing glue; the upper liquid-filled cavity is located between the transparent ceramic fluorescent cover plate and the COB module and is filled with heat transfer fluid; the lower liquid-filled cavity is located under the COB module, is communicated with the upper charging cavity, and is filled with heat transfer fluid and heat storage type phase change particles; the heat radiator is arranged on an outer ring of the lower liquid-filled cavity in a surrounding way and is connected to the lower parts of the reflection cup and the COB module. The high-power white-light LED excellent in heat radiation is not only excellent in light emission, but also excellent in heat radiation.

Description

technical field [0001] The invention relates to a high-power white light LED, in particular to a high-power white light LED with good heat dissipation and a manufacturing method thereof. Background technique [0002] Since Edison invented the incandescent lamp in 1882, human lighting sources have gone through three stages: incandescent lamps, neon lamps, and gas discharge lamps. As a real revolution in lighting technology, white LED is known as the fourth generation of lighting sources. Compared with traditional lighting, the significant difference is that white LEDs use semiconductor materials to directly convert electrical energy into light, while the light does not generate heat, and has the characteristics of long life, energy saving, and environmental protection. [0003] Fluorescent conversion technology is still the mainstream technology for manufacturing white LEDs at home and abroad. The traditional fluorescent conversion technology is to apply yellow phosphor pow...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/64H01L33/00
CPCH01L33/005H01L33/60H01L33/648
Inventor 叶尚辉陈明秦张数江
Owner FUJIAN CAS CERAMIC OPTOELECTRONICS TECH CO LTD
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