A long-life LED lighting module and its processing method

A light-emitting module, long-life technology, applied in electrical components, circuits, semiconductor devices, etc., can solve problems such as failure and disconnection of LED lights, and achieve the effects of reducing internal stress, reducing uneven stress and prolonging life.
CN104518067BActive Publication Date: 2017-07-14徐州泰铭电气有限公司
1 Cites 0 Cited by

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
徐州泰铭电气有限公司
Publication Date
2017-07-14

Smart Images

  • Figure 1
    Figure 1
  • Figure 2
    Figure 2
Patent Text Reader

Abstract

The invention provides a long-life LED light-emitting module and a processing method thereof. The LED light-emitting module comprises a transparent base, multiple LED dies and fluorescent powder rubber layers. The LED dies are bound on the front of the transparent base and arranged and bound according to at least one annular ring. The first fluorescent powder rubber layer covers the back of the transparent base. The second fluorescent powder rubber layer coats the front of the transparent base and is divided into at least one circular fluorescent powder rubber ring, the fluorescent powder rubber rings are in one-to-one correspondence to the annular rings, and each fluorescent powder rubber ring covers all the LED dies of the corresponding annular ring. The problem of LED lamp failure caused by the fact that gold wires of the LED light source module are disconnected under the impact of cyclic stress due to thermal expansion and contraction of the rubber layers is solved.
Need to check novelty before this filing date? Find Prior Art

Description

technical field

[0001] The invention relates to an LED light-emitting module and a processing method, in particular to a long-life LED light-emitting module and a processing method. Background technique

[0002] The current mainstream packaging process for LED lamps is MCOB, which is formed by directly bonding the bare LED chip to the substrate with a die-bonding insulating adhesive, and then coating the bare LED chip with phosphor powder to convert the color of the light. In order to realize the 360-degree luminous effect of the LED light-emitting module, the substrate is usually a transparent substrate, and the side of the substrate that is not bonded to the bare LED crystal is also coated with phosphor glue for color conversion of the light. Such as the invention patent "201310244265.1", an LED bulb with omnidirectional light emission, the LED chip is fixed on the transparent substrate with crystal-bonding insulating glue, the surface of the LED chip and the back of the t...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More