Coarse micro-etching agent used in circuit board and preparation method of coarse micro-etching agent

Abstract

The invention relates to the technical field of metal surface treatment chemicals, in particular to a coarse micro-etching agent used in a circuit board and a preparation method of the coarse micro-etching agent. The coarse micro-etching agent is composed of, by weight, 5%-10% of sulfuric acid, 0.01%-0.1% of copper sulfate pentahydrate, 0.05%-1% of piperidine or 4-Cloperastine or 4-Hydroxypiperidine or 4-aminopiperidine, 0.1%-1% of 2-aminobenzimidazole or 2-mercapto benzimidazole or benzimidazole-2-methanal or 2-alkylbenzimidazole or 2-phenylbenzimidazole or 2-(4-pyridine) benzimidazole or 2-(4-benzyl) benzimidazole, 0.1%-1% of benzenesulfonic acid or p-chlorobenzenesulfonic acid or sulfanilic acid or p-methyl benzene sulfonic acid, 0.05%-1% of tetrazole or 5-amino-1H-tetrazole hydrate or 5-methyl tetrazole or 5-phenyl-tetrazole and the balance being deionized water. The coarse micro-etching agent used in the circuit board is stable in component, long in service life, capable of effectively removing oxides on the surface of metal and enabling the surface of the metal to be in proper coarse degree after micro-etching and especially suitable for increasing the binding force of a dry film and the copper surface in the process of pressing the dry film; in addition, through control over the coarse degree, the dry film is firm during pressing, and the exposed dry film can be removed more easily.

Description

technical field [0001] The invention relates to the technical field of metal surface treatment agents, in particular to a medium-roughening microetch agent for circuit boards and a preparation method thereof. Background technique [0002] In the process of manufacturing circuit boards, in order to improve the adhesion of the metal and facilitate the subsequent pressing process of the process, it is necessary to remove the oxide on the surface of the metal before using it. At present, surface treatment agents with strong oxidizing properties are often used to remove oxides on the metal surface and form a rough surface. [0003] However, the existing technology is difficult to control the roughness of metal surface treatment. If the roughness is too small, the dry film will not be firm, and if the roughness is too large, the dry film after exposure will not be easy to remove, which will bring trouble to production and increase. Processing time and cost. Therefore, the develo...

AI Technical Summary

Problems solved by technology

[0003] However, the existing technology is difficult to control the roughness of metal surface treatment. If the roughness is too small, the dry film will not be firm, and if the roughness is too large, the dry film after exposure will not be easy to remove, which will bring trouble to production and increase Processing time and cost

Images