Coarse micro-etching agent used in circuit board and preparation method of coarse micro-etching agent

A circuit board and roughening technology, which is applied in the field of medium-coarsening micro-etching agent and its preparation, can solve the problems of troublesome production, weak dry film, increased processing time and cost, etc. long life effect

Inactive Publication Date: 2015-04-22
东莞市富默克化工有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the existing technology is difficult to control the roughness of metal surface treatment. If the roughness is too small, the dry film will not be firm, and if the roughness is too large, the dry film after exposure will not be easy to remove, which will bring trouble to production and increase Processing time and cost

Method used

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  • Coarse micro-etching agent used in circuit board and preparation method of coarse micro-etching agent
  • Coarse micro-etching agent used in circuit board and preparation method of coarse micro-etching agent
  • Coarse micro-etching agent used in circuit board and preparation method of coarse micro-etching agent

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0090] A medium-roughened microetching agent for circuit boards, which consists of the following raw materials in percentage by weight:

[0091] Sulfuric acid 3%

[0092] Copper Sulfate Pentahydrate 0.1%

[0093] Piperidine 0.05%

[0094] 2-aminobenzimidazole 0.5%

[0095] p-chlorobenzenesulfonic acid 0.2%

[0096] 5-methyltetrazolium 0.05%;

[0097] Deionized water balance.

[0098] The mass concentration of the sulfuric acid is 98%.

[0099] The invention discloses a preparation method of a medium-coarsening microetch agent for circuit boards. The above-mentioned several substances are added into a reactor and stirred evenly to obtain a medium-coarseness microetch agent for circuit boards.

[0100] The surface treatment agent prepared in this example has stable components and long service life. The metal substrate is soaked with the surface treatment agent obtained in this example. The temperature of the surface treatment agent is 35° C., and the soaking time is 1 mi...

Embodiment 2

[0102] A medium-roughened microetching agent for circuit boards, which consists of the following raw materials in percentage by weight:

[0103] Sulfuric acid 9%

[0104] Copper Sulfate Pentahydrate 0.1%

[0105] Piperidine 0.05%%

[0106] 2-aminobenzimidazole 1%

[0107] p-chlorobenzenesulfonic acid 0.5%

[0108] 5-methyltetrazolium 0.5%;

[0109] Deionized water balance.

[0110] The mass concentration of the sulfuric acid is 98%.

[0111] The invention discloses a preparation method of a medium-coarsening microetch agent for circuit boards. The above-mentioned several substances are added into a reactor and stirred evenly to obtain a medium-coarseness microetch agent for circuit boards.

[0112] The surface treatment agent prepared in this example has stable components and long service life. The metal substrate is soaked with the surface treatment agent obtained in this example. The temperature of the surface treatment agent is 38° C., and the soaking time is 2 minu...

Embodiment 3

[0114] A medium-roughened microetching agent for circuit boards, which consists of the following raw materials in percentage by weight:

[0115] Sulfuric acid 10%

[0116] Copper sulfate pentahydrate 0.01%%

[0117] 4-aminopiperidine 1%

[0118] 2-(4-Pyridine)benzimidazole 0.1%

[0119] p-Toluenesulfonic acid 1.0%

[0120] 5-Phenyltetrazolium 0.05%

[0121] Deionized water balance.

[0122] The mass concentration of the sulfuric acid is 98%.

[0123] The invention discloses a preparation method of a medium-coarsening microetch agent for circuit boards. The above-mentioned several substances are added into a reactor and stirred evenly to obtain a medium-coarseness microetch agent for circuit boards.

[0124] The surface treatment agent prepared in this example has stable components and long service life. The metal substrate is soaked with the surface treatment agent obtained in this example. The temperature of the surface treatment agent is 40° C., and the soaking time is...

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Abstract

The invention relates to the technical field of metal surface treatment chemicals, in particular to a coarse micro-etching agent used in a circuit board and a preparation method of the coarse micro-etching agent. The coarse micro-etching agent is composed of, by weight, 5%-10% of sulfuric acid, 0.01%-0.1% of copper sulfate pentahydrate, 0.05%-1% of piperidine or 4-Cloperastine or 4-Hydroxypiperidine or 4-aminopiperidine, 0.1%-1% of 2-aminobenzimidazole or 2-mercapto benzimidazole or benzimidazole-2-methanal or 2-alkylbenzimidazole or 2-phenylbenzimidazole or 2-(4-pyridine) benzimidazole or 2-(4-benzyl) benzimidazole, 0.1%-1% of benzenesulfonic acid or p-chlorobenzenesulfonic acid or sulfanilic acid or p-methyl benzene sulfonic acid, 0.05%-1% of tetrazole or 5-amino-1H-tetrazole hydrate or 5-methyl tetrazole or 5-phenyl-tetrazole and the balance being deionized water. The coarse micro-etching agent used in the circuit board is stable in component, long in service life, capable of effectively removing oxides on the surface of metal and enabling the surface of the metal to be in proper coarse degree after micro-etching and especially suitable for increasing the binding force of a dry film and the copper surface in the process of pressing the dry film; in addition, through control over the coarse degree, the dry film is firm during pressing, and the exposed dry film can be removed more easily.

Description

technical field [0001] The invention relates to the technical field of metal surface treatment agents, in particular to a medium-roughening microetch agent for circuit boards and a preparation method thereof. Background technique [0002] In the process of manufacturing circuit boards, in order to improve the adhesion of the metal and facilitate the subsequent pressing process of the process, it is necessary to remove the oxide on the surface of the metal before using it. At present, surface treatment agents with strong oxidizing properties are often used to remove oxides on the metal surface and form a rough surface. [0003] However, the existing technology is difficult to control the roughness of metal surface treatment. If the roughness is too small, the dry film will not be firm, and if the roughness is too large, the dry film after exposure will not be easy to remove, which will bring trouble to production and increase. Processing time and cost. Therefore, the develo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23F1/16
Inventor 王维仁伊洪坤
Owner 东莞市富默克化工有限公司
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