Laser processing system and method for liquid film protection

A laser processing method and laser processing technology, which are applied in laser welding equipment, metal processing equipment, manufacturing tools, etc., can solve problems such as affecting the stability of underwater laser processing, producing ripples and bubbles in aqueous solutions, and affecting surface cleanliness, etc. Achieve the effect of reducing surface spatter deposition, reducing thermal damage, and reducing spatter deposition

Active Publication Date: 2016-04-13
GUILIN UNIV OF ELECTRONIC TECH
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Problems solved by technology

However, in the process of underwater laser processing, the laser heating causes ripples and bubbles in the aqueous solution, which disturbs the transmission of the laser, affects the stability of the underwater laser processing process and reduces the processing quality.
[0003] In addition, when the processed sample has multiple cutting lines, the vacuum chuck used to fix the sample will absorb the solution, and the surface of the processed sample will be dry, resulting in the adhesion of suspended particles generated during processing, affecting its surface cleanliness

Method used

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  • Laser processing system and method for liquid film protection

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Embodiment Construction

[0028] Embodiment of laser processing system protected by liquid film

[0029] The embodiment of the laser processing system protected by the liquid film comprises a laser device 10, a workbench 2, a jet nozzle and a container 1, the workpiece 3 to be processed is fixed on the upper surface of the workbench 2, the surface of the workpiece 3 to be processed is horizontal, and the laser device The laser beam 11 generated by 10 is focused on the surface of the workpiece 3 to be processed, the workbench 2 is installed in the container 1 , and the drain pipe 4 of the container 1 is lower than the upper surface of the workbench 2 . Also be furnished with nozzle, the spout diameter d of main nozzle 12 1 =1.5mm, the intersection angle θ between the centerline of the main nozzle 12 and the horizontal plane 1 is 45°, the distance between the nozzle center of the main nozzle 12 and the surface of the workpiece 3 is SOD 1 = 3mm, the distance between the center line of the main nozzle 12...

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Abstract

The invention discloses a liquid film protecting laser processing system and method. According to the liquid film protecting laser processing system, a workbench where a workpiece is fixed is installed in a container, and lasers focus on the surface of the workpiece; a main spray nozzle and an auxiliary spray nozzle are matched, when the main spray nozzle and the auxiliary spray nozzle are compared, the intersection angle between the center line of the main spray nozzle and the horizontal plane is smaller, the distance between the main spray nozzle and the surface of the workpiece is smaller, the jet flow pressure of the main spray nozzle ranges from 5Mpa to 50Mpa, and the laser focus point is located in an area of intersection between a jet flow beam of the main spray nozzle and the surface of the workpiece; the auxiliary spray nozzle is opposite to the main spray nozzle, and is located on the other side of a laser beam, and the jet flow pressure of the auxiliary spray nozzle ranges from 0.05Mpa to 0.2Mpa. The liquid film protecting laser processing method comprises the steps that a thin liquid film protecting layer which stably flows to the outer edge of the workpiece is formed by jet flow sprayed by the main spray nozzle and the auxiliary spray nozzle on the surface of the workpiece, and the laser beam passes through a liquid film and focuses on the surface of the workpiece to conduct processing. According to the liquid film protecting laser processing system and method, the thin water film which continuously flows takes cuttings and heat away, the high-pressure jet flow can also remove materials which are softened through heating, the continuous liquid film covers the surface of the whole workpiece, adhesion of suspended particles is avoided, and the cleanliness is improved.

Description

technical field [0001] The invention relates to the technical field of laser processing, in particular to a laser processing system and method for liquid film protection. Background technique [0002] The laser is an effective tool for both macro and submicron fabrication because its small, high-energy beam meets all the basic needs of material processing. However, thermal damage is unavoidable in laser processing. Although ultrashort lasers can reduce thermal effects on materials, they suffer from low material removal rates and high photon costs. In recent years, scholars have been conducting research on laser processing methods to reduce thermal damage, among which the traditional underwater laser processing method is a better choice. However, during the underwater laser processing process, the laser heating causes ripples and bubbles in the aqueous solution, which disturbs the transmission of the laser, affects the stability of the underwater laser processing process an...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/146B23K26/142
Inventor 龙芋宏冯唐高杨晓清童友群刘鑫
Owner GUILIN UNIV OF ELECTRONIC TECH
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