Etching fluid for forming texture and texture-forming method using same
A technology of etching liquid and compound, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problem that etching liquid cannot be directly used on silicon substrates, etc., and achieve the effect of high safety and improved performance
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[0073] Hereinafter, the present invention will be further specifically described through examples, but the present invention is not limited by the following examples.
[0074] [Example, comparative example]
[0075] An aqueous solution obtained by mixing an alkali component (A), a phosphonic acid derivative (B), and a compound (C) in the ratios shown in the following tables was prepared to prepare an etching solution. Ion-exchanged water was used as water for preparation.
[0076] These etching solutions were heated to 80°C, and the single crystal silicon substrate wafers (hereinafter referred to as "wafers") which were ground by either the free abrasive method or the fixed abrasive method respectively shown in the table were ground. ”) was immersed therein for 20 minutes to perform etching treatment, washed with water and then dried, and the evaluation of the texture structure and the measurement of the reflectance were performed as follows. The results are shown in each ta...
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