The invention provides a high-adhesion heat-conducting
polyimide film and a preparation method thereof. The
polyimide film is prepared by adding a special
fluorine-containing anilino phosphonic
acid derivative, a certain proportion of spherical
silicon oxide,
boron nitride and
diatom ooze as inorganic modifiers in the
polyimide preparation process. By utilizing a pi-pi conjugated structure and an
amide group in the
fluorine-containing anilino phosphonic
acid derivative, the polyimide film has excellent deformation resistance; in addition, by adding the
fluorine-containing anilino phosphonic
acid derivative, not only can the water absorption of the polyimide film be reduced, but also the
adhesive force of the film on the surface of a
copper foil can be improved. In addition, due to a layered breathable structure of the nano-scale
silicon oxide particles, the micron-scale flaky
boron nitride and the
diatom ooze, the defect that the heat
conductivity is reduced due to the existence of the fluorine-containing anilino phosphonic acid derivative is overcome, and the heat
conductivity coefficient of the obtained polyimide film is not lower than 1.0 W / (mk).