Preparation method of plating solution for copper plating on graphite powder surface
A preparation method and technology of graphite powder, applied in the field of graphite plating solution, can solve the problems of shedding of the coating, low interface bonding strength, unreasonable preparation of the plating solution, etc., and achieve the effect of continuous plating and ensuring stability
Inactive Publication Date: 2015-05-06
QINGDAO TAIHAODA CARBON MATERIAL
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Problems solved by technology
However, in the prior art, the interface between copper and graphite composite materials can only be connected together through mechanical interlocking, and the bonding strength between the interfaces is low. When the material is under load, it is easy to cause the pull-out, peeling or falling off of the graphite reinforcement. There is technology, and the way to solve this problem is to plate copper on the surface of graphite powder, and then mix the copper-plated graphite powder with copper to make a metal-graphite composite material.
In the process of copper plating, the plating solution needs to be in full contact with the surface of graphite particles to achieve a good use effect. The unreasonable preparation of the plating solution will easily lead to the coating falling off
Method used
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Embodiment
[0013] The preparation method of the used plating solution of the graphite powder surface copper plating of the present embodiment comprises the following steps (1) preparing raw materials: copper sulfate pentahydrate, formaldehyde, ethylenediaminetetraacetic acid, potassium sodium tartrate, stabilizer according to 1:1.6: 1.6:1:0.001 ratio for weighing; (2) Fully dissolve and mix the raw materials weighed in step (1) at a temperature of 60°C, and then adjust the pH value with 20% aqueous sodium hydroxide solution at 12.
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The invention discloses a preparation method of a plating solution for copper plating on graphite powder surface. The method is as below: (1) weighing blue copperas, formaldehyde, EDTA, potassium sodium tartrate and a stabilizer according to the ratio of 1:1.6:1.6:1:0.001; and (2) fully dissolving and mixing the raw materials at the temperature of 60 DEG C, and adjusting the pH at 12-13 by using a 20% aqueous solution of sodium hydroxide. The invention uses the 20% aqueous solution of sodium hydroxide to adjust the pH at 12-13, and ensures the stability of plating solution, so as to ensure the continuousness, stability and uniformity of the coating.
Description
[0001] technical field [0002] The invention belongs to the technical field of graphite plating solution, in particular to a method for preparing a plating solution for copper plating on the surface of graphite powder. [0003] Background technique [0004] Composite materials made of copper and graphite have the advantages of both, including electrical conductivity, thermal conductivity, lubricity, and high mechanical strength, so they are widely used. However, in the prior art, the interface between copper and graphite composite materials can only be connected together through mechanical interlocking, and the bonding strength between the interfaces is low. When the material is under load, it is easy to cause the pull-out, peeling or falling off of the graphite reinforcement. There is technology, and the way to solve this problem is to plate copper on the surface of graphite powder, and then mix copper-plated graphite powder with copper to make a metal-graphite composite ...
Claims
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Inventor 乔帅
Owner QINGDAO TAIHAODA CARBON MATERIAL
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