Anisotropic conductive film, connection method, and connected body

An anisotropic, conductive film technology, applied in the direction of conductive connection, electrical component connection, conductive adhesive, etc., can solve the problems of inability to prevent wiring corrosion, insufficient adhesion, etc., and achieve excellent particle capture rate, high density Excellent compatibility and anti-corrosion effect

Active Publication Date: 2015-05-06
DEXERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, simply mixing metal hydroxide or metal oxide into an anisotropic conductive film using a

Method used

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  • Anisotropic conductive film, connection method, and connected body
  • Anisotropic conductive film, connection method, and connected body
  • Anisotropic conductive film, connection method, and connected body

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0118] Example

[0119] Hereinafter, examples of the present invention will be described, but the present invention is not limited by these examples at all.

Example Embodiment

[0120] (Manufacturing example)

[0121]

[0122] Each aluminum hydroxide used in the following examples and comparative examples is manufactured by referring to the aluminum hydroxide manufacturing method described in paragraphs [0019] to [0023] of JP 2005-162606 A .

[0123] In addition, magnesium hydroxide, aluminum oxide, and magnesium oxide are manufactured by the same method as the manufacturing method of aluminum hydroxide.

Example Embodiment

[0124] (Example 1)

[0125]

[0126] -Production of conductive particle-containing layer-

[0127] 25 parts by mass of phenoxy resin (PKHH, manufactured by Pakistan Industrial Co., Ltd.), 10 parts by mass of epoxy resin (EP1001, manufactured by Mitsubishi Chemical Co., Ltd.), and cationic curing agent (SI-60L, manufactured by Sanshin Chemical Co., Ltd.) , Sulfonium salt type cationic curing agent) 10 parts by mass, silane coupling agent (A-187, manufactured by Momentive High-tech Materials Co., Ltd.) 2 parts by mass, conductive particles (AUL704, manufactured by Sekisui Chemical Industry Co., Ltd., in acrylic resin The surface of the particles is formed with metal-coated resin particles of Ni / Au plating film, average particle size 4.0μm) 30 parts by mass and aluminum hydroxide (unshaped, average particle size 0.7μm) 0.1 parts by mass, using a stirring device (rotation and revolution mixing) Machine, Defoaming Nintaro, manufactured by THINKY Co., Ltd.), and mixed so as to become un...

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Abstract

An anisotropic conductive film produced by the anisotropic conductive connection between a terminal of a first electronic component and a terminal of a second electronic component, said anisotropic conductive film comprising a conductive-particle-containing layer that contains conductive particles, a filler and a cationic curing agent and an insulating adhesive layer that contains a cationic curing agent but contains no filler, wherein the conductive particles are metal particles and/or metal-coated resin particles, and the filler is a metal hydroxide and/or a metal oxide.

Description

technical field [0001] The present invention relates to an anisotropic conductive film, a connection method and a bonded body. Background technique [0002] Conventionally, as means for connecting electronic components, a tape-shaped connecting material (for example, anisotropic conductive film (ACF; Anisotropic Conductive Film)) in which curable resin in which conductive particles are dispersed is applied to a release film is used. [0003] The anisotropic conductive film is mainly used to connect the terminals of the flexible printed circuit board (FPC) or IC chip and the ITO (Indium Tin Oxide) electrode formed on the glass substrate of the LCD panel, and is used for bonding various The case where the terminals are electrically connected to each other at the same time. [0004] In recent years, in the anisotropic conductive connection between electronic components using the above-mentioned anisotropic conductive film, in order to cope with the high density of the bonded b...

Claims

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Application Information

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IPC IPC(8): C09J7/00C09J9/02C09J11/04C09J201/00H01R11/01C09J7/22
CPCC08K3/22C09J2203/326C09J7/22C09J2301/314C09J2301/41
Inventor 深谷达朗伊藤将太
Owner DEXERIALS CORP
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