Anisotropic conductive film, connection method, and bonded body

An anisotropic, conductive film technology, applied in the direction of conductive connection, electrical component connection, conductive adhesive, etc., can solve the problems of inability to prevent wiring corrosion, insufficient adhesion, etc., and achieve excellent particle capture rate, high density Excellent compatibility and anti-corrosion effect

Active Publication Date: 2016-10-19
DEXERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, simply mixing metal hydroxide or metal oxide into an anisotropic conductive film using a cationic curing agent cannot prevent wiring corrosion
In addition, the adhesiveness is not enough

Method used

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  • Anisotropic conductive film, connection method, and bonded body
  • Anisotropic conductive film, connection method, and bonded body
  • Anisotropic conductive film, connection method, and bonded body

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0119] Hereinafter, examples of the present invention will be described, but the present invention is not limited by these examples.

manufacture example

[0121]

[0122] Each of the aluminum hydroxides used in the following examples and comparative examples was produced by appropriately adjusting the production method of aluminum hydroxide described in paragraphs [0019] to [0023] of JP-A-2005-162606 .

[0123] In addition, magnesium hydroxide, aluminum oxide, and magnesium oxide were produced by the same method as the production method of aluminum hydroxide.

Embodiment 1

[0125]

[0126] -Formation of conductive particle-containing layer-

[0127] 25 parts by mass of phenoxy resin (PKHH, manufactured by Pakistan Industrial Co., Ltd.), 10 parts by mass of epoxy resin (EP1001, manufactured by Mitsubishi Chemical Corporation), cationic curing agent (SI-60L, manufactured by Sanshin Chemical Industry Co., Ltd. , sulfonium salt type cationic curing agent) 10 parts by mass, silane coupling agent (A-187, manufactured by Momentive Advanced Materials Co., Ltd.) 2 parts by mass, conductive particles (AUL704, manufactured by Sekisui Chemical Industry Co., Ltd., in acrylic resin The surface of the particles is formed with Ni / Au plated film metal coating resin particles, average particle diameter 4.0 μm) 30 mass parts and aluminum hydroxide (indeterminate, average particle diameter 0.7 μ m) 0.1 mass parts using a stirring device (rotation revolution mixing machine, defoaming Rentaro, manufactured by THINKY Co., Ltd.) and mixed so as to become uniform. The...

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Abstract

An anisotropic conductive film, which is an anisotropic conductive film for anisotropic conductive connection between a terminal of a first electronic component and a terminal of a second electronic component, and comprises conductive particles, a filler, and a cationic curing agent. A layer containing conductive particles of an agent and an insulating adhesive layer containing a cationic curing agent and not containing a filler, the conductive particles are at least any one of metal particles and metal-coated resin particles, and the filler is At least one of metal hydroxides and metal oxides.

Description

technical field [0001] The present invention relates to an anisotropic conductive film, a connection method and a bonded body. Background technique [0002] Conventionally, as means for connecting electronic components, a tape-shaped connecting material (for example, anisotropic conductive film (ACF; Anisotropic Conductive Film)) in which curable resin in which conductive particles are dispersed is applied to a release film is used. [0003] The anisotropic conductive film is mainly used to connect the terminals of the flexible printed circuit board (FPC) or IC chip and the ITO (Indium Tin Oxide) electrode formed on the glass substrate of the LCD panel, and is used for bonding various The case where the terminals are electrically connected to each other at the same time. [0004] In recent years, in the anisotropic conductive connection between electronic components using the above-mentioned anisotropic conductive film, in order to cope with the high density of the bonded b...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01R11/01C09J7/00C09J9/02C09J11/04C09J201/00C09J7/22
CPCC08K3/22C09J2203/326C09J7/22C09J2301/314C09J2301/41
Inventor 深谷达朗伊藤将太
Owner DEXERIALS CORP
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