A method for synthesizing graphene from a solid carbon source in a two-stage process at atmospheric pressure
A solid carbon source, a technology for synthesizing graphite, applied in the direction of graphene, nano-carbon, etc., can solve the problems of unsuitability for industrial production, high energy consumption, high equipment requirements, and achieve the effect of low cost, low energy consumption and high quality
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[0017] The present invention provides a preparation method. The present invention will be described in detail with reference to the accompanying drawings, including the following steps:
[0018] (1) Cleaning SiO 2 / Si substrate and metal substrate:
[0019] ① Put a certain size of SiO 2 The / Si substrate was placed in clean acetone and isopropanol for 5 minutes ultrasonic cleaning, rinsed with deionized water, and dried.
[0020] ②Metal base refers to copper foil. Put a certain size of copper foil into clean diluted acetic acid, acetone, isopropanol, and ultrasonically clean for 5 minutes, rinse with deionized water, and dry.
[0021] (2) Step 1) processed SiO 2 The / Si substrate is placed in a magnetron sputtering apparatus, and the magnetron sputtering technology is used to optimize the sputtering conditions and deposit a layer of cobalt film. Then, a certain thickness of amorphous carbon is sputtered on the cobalt film.
[0022] (3) SiO with metal and amorphous carbon deposited sequ...
example 1
[0026] Example 1: With the change of CVD time, compare the evolution of graphene film under different reaction times.
[0027] Follow step 1) in ① and step 2) in 1cm*1cm SiO 2 / Si substrate is deposited with metallic Co, and then amorphous carbon is deposited for 1 min; then the cobalt film and SiO of amorphous carbon will be deposited 2 / Si wafer (amorphous carbon / cobalt film / SiO 2 / Si) and the 1cm*1cm copper foil cleaned by the method in step 1) and put into the quartz tube. According to step 3), the air in the reaction chamber is exhausted. Ar and H for access 2 The numerical range of the flow rate is 300-600sccm and 30-80sccm respectively. The temperature of the front temperature zone is increased to 700℃, and the temperature of the rear temperature zone is 1050℃. At this temperature, keep the carrier gas unchanged. After the constant temperature annealing time is in the range of 30-90min, the amorphous carbon / cobalt film / SiO 2 / Si wafer is pushed into the central area of t...
example 2
[0029] Example 2: Compare the influence of the amount of sputtering deposition of amorphous carbon on synthetic graphene. Figure 5 Shown are the optical micrographs and the corresponding Raman spectra of graphene synthesized under the conditions of sputtering amorphous carbon at different times.
[0030] Follow step 1) in ① and step 2) in 1cm*1cm SiO 2 / Si substrate is deposited with metal Co, and then 0.5min, 1min, and 2min of amorphous carbon are deposited respectively (as shown in Figure (5a-c)); then the cobalt film and amorphous carbon SiO 2 / Si (amorphous carbon / cobalt film / SiO 2 / Si) piece and the copper foil of 1cm*1cm cleaned according to the method in step 1) and put into the quartz tube. According to step 3), the air in the reaction chamber is exhausted. Ar and H for access 2 The numerical range of the flow rate is 300-600sccm and 30-80sccm respectively. The temperature of the front temperature zone is increased to 700℃, and the temperature of the rear temperature zo...
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