Novel high-pressure bright nickel-electroplating device and nickel-plating method thereof

Abstract

The invention relates to a novel high-pressure bright nickel-electroplating device and a nickel-plating method thereof. The novel high-pressure bright nickel-electroplating device comprises a high-pressure plating tank, a sealing cover, sealing devices and locking devices, wherein the sealing cover covers the high-pressure plating tank and is fastened by the locking devices; a pressure gauge, a safety valve and a water inlet valve are welded on the sealing cover; a drain valve is welded at the lower part of the high-pressure plating tank; the four sealing devices are welded outside the high-pressure plating tank; a cross-shaped partition board is welded in the high-pressure plating tank; the four sealing device are located on four upward extending lines of the cross-shaped partition board; the high-pressure plating tank is divided into four parts by the cross-shaped partition board; support bars are arranged at each part; one end of each support bar is welded on the partition board; a cathode and an anode are placed on each support bar; membrane pressure gauges are correspondingly arranged at the four parts of the high-pressure plating tank respectively; the cathodes and the anodes are connected with corresponding electrode wires respectively; the two electrode wires extend out of the sealing devices respectively and then are connected with a pulsed power supply. The novel high-pressure bright nickel-electroplating device can promote a hydrogen evolution reaction, reduce the hydrogen content and sulphur content of a plated layer and enhance the binding force of the plated layer by virtue of high pressure, thereby improving the quality of the plated layer.

Description

Technical field [0001] The invention relates to the field of electrochemical processing, in particular to a novel high-pressure bright nickel plating electroplating device and a nickel plating method thereof. Background technique [0002] With the rapid development of science and technology, nickel electroplating has become more and more important in industrial production. Electroplated nickel has the characteristics of high stability, high gloss, high hardness, wide application and low consumption, and it plays an increasingly important role in actual production. As a kind of nickel electroplating, bright nickel plating has many advantages. Its polishing process is simple, electroplating and polishing materials use less materials, and the coating hardness is higher. Compared with ordinary nickel plating, the pH value requirement of bright nickel plating is higher than ordinary nickel plating. Nickel plating is low, and the temperature and current density are higher than ordinar...

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a novel high-voltage bright nickel electroplating device. This novel high-voltage bright nickel electroplating device is used to solve the problem that sulfur is contained in the coating of the current bright nickel plating, which causes the internal stress and brittleness of the coating to be large and corrosion-resistant. Another object of the present invention is to provide the nickel-plating method of this novel high-voltage bright nickel-plating electroplating device

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