Copper foil provided with carrier

Abstract

Provided is a copper foil provided with a carrier, suitable for forming a fine pitch. A copper foil provided with a carrier, comprising a copper foil carrier, a release layer layered onto the copper foil carrier, and a very thin copper layer layered onto the release layer; wherein the very thin copper layer has been roughened and the Rz of the very thin copper layer surface is 1.6 μm or less as measured with a non-contact roughness meter.

Description

technical field [0001] The invention relates to a copper foil with a carrier. More specifically, this invention relates to the copper foil with a carrier used as the material of a printed wiring board. Background technique [0002] A printed wiring board is usually produced through a process of forming a conductive pattern on the copper foil surface by etching after bonding an insulating substrate and copper foil to form a copper-clad laminate. With the increasing demand for miniaturization and high performance of electronic equipment in recent years, high-density packaging of mounted components and high-frequency signals are promoted, and the miniaturization of conductor patterns (narrow pitch) is required for printed wiring boards. ) or high-frequency response, etc. [0003] Corresponding to the narrow pitch, copper foil with a thickness of 9 μm or less, and even a thickness of 5 μm or less has recently been required. However, such extremely thin copper foil has low mech...

AI Technical Summary

Problems solved by technology

[0005] However, even in printed wiring boards, if such an ultra-thin copper layer with a large outline (concave-convex, roughness) is used on a semiconductor package substrate that needs to form a particularly fine circuit pattern, undesired copper will remain when the circuit is etched. Necessary copper particles may cause problems such as poor insulation between circuit patterns

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