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High temperature resistant release adhesive tape as well as preparation method and use of adhesive tape

A high-temperature-resistant, release-type technology, applied in chemical instruments and methods, adhesives, epoxy resin glue, etc., can solve the problems of increasing production costs and achieve the effect of low cost

Active Publication Date: 2015-05-20
厦门新旺新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

increase production cost

Method used

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  • High temperature resistant release adhesive tape as well as preparation method and use of adhesive tape

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Experimental program
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Effect test

Embodiment 1

[0051] Embodiment 1: Preparation of high temperature resistant release tape

[0052] 1. Making film: use a blow molding machine to make a base material mainly made of PA6 mixed with PA66; the weight ratio of PA66 to PA6 is PA66:PA6=2:1. The preparation method can be according to the conventional method. The thickness of gained film is 50um;

[0053] 2. Surface energy reduction treatment: corona treatment, 18-35kHz, 0.5-1.0s;

[0054] 3. Preparation of the release layer: use the conventional coating process, cover the release surface of the film obtained in step 1 with dimethyl silicone oil, bake (30-50 meters, 90-110°C, 3-5min) dry and then fully cool ; The resulting release layer is 10um;

[0055] 4. Prepare the adhesive layer: use the conventional coating process, cover the adhesive surface of the film obtained in step 2 with high-temperature resistant epoxy glue, and dry it after baking (30-50 meters, 90-110°C, 3-5min) Fully cooled; the resulting adhesive layer is 10u...

Embodiment 2

[0058] Embodiment 2: Preparation of high temperature resistant release tape

[0059] 1. Making film: use a blow molding machine to make a base material mainly made of PA6 mixed with PA66; the weight ratio of PA66 to PA6 is PA66:PA6=5:1. The preparation method can be according to the conventional method. The thickness of gained film is 50um;

[0060] 2. Surface energy reduction treatment: corona treatment, 18-35kHz, 0.5-1.0s;

[0061] 3. Preparation of the release layer: use the conventional coating process, cover the release surface of the film obtained in step 1 with dimethyl silicone oil, bake (30-50 meters, 90-110°C, 3-5min) dry and then fully cool ; The resulting release layer is 10um;

[0062] 3. Prepare the adhesive layer: use the conventional coating process, cover the adhesive surface of the film obtained in step 2 with phenolic resin glue, dry it after baking (30-50 meters, 90-110°C, 3-5min) and then fully cool ; The resulting adhesive layer is 10um;

[0063] 4...

Embodiment 3

[0065] Embodiment 3: Preparation of high temperature resistant release tape

[0066] 1. Making film: use a blow molding machine to make a base material mainly made of PA6 mixed with PA66; the weight ratio of PA66 to PA6 is PA66:PA6=1:5. The preparation method can be according to the conventional method. The thickness of gained film is 50um;

[0067] 2. Surface energy reduction treatment: corona treatment, 18-35kHz, 0.5-1.0s;

[0068] 3. Preparation of the release layer: use the conventional coating process, cover the release surface of the film obtained in step 1 with dimethyl silicone oil, bake (30-50 meters, 90-110°C, 3-5min) dry and then fully cool ; The resulting release layer is 10um;

[0069] 3. Prepare the adhesive layer: use the conventional coating process, cover the adhesive surface of the film obtained in step 2 with high-temperature resistant epoxy glue, and dry it after baking (30-50 meters, 90-110°C, 3-5min) Fully cooled; the resulting adhesive layer is 10u...

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Abstract

The invention discloses a high temperature resistant release adhesive tape as well as a preparation method and the use of the adhesive tape. The high temperature resistant release adhesive tape is composed of a release layer, a substrate and an adhesive layer, wherein the release layer and the adhesive layer are formed on the substrate in a coating or spray-coating manner; the substrate is a thin film prepared from the mixed material of PA6 and PA66, or PA6, or PA66 as a major material. The preparation method comprises the following steps: firstly, preparing the substrate from the mixed material of PA6 and PA66, or PA6, or PA66 as the major material; secondly, treating the thin film by use of a corona treater to reduce the surface energy; thirdly, forming the release layer and the adhesive layer on the corresponding release surface and adhesive surface of the thin film in a coating or spray-coating manner respectively; and finally, slitting and curling, and packaging to obtain a finished product. The high temperature resistant release adhesive tape is low in cost, and capable of bearing the use temperature within the range of 150 to 220 DEG C without melting, embrittlement, breakage and the like. The high temperature resistant release adhesive tape can be widely applied to composite materials, and to the fields of bicycle frame five-way part wrapping, the difficult corner mold stripping parts of other pipe fittings, vacuum-pumping process sealing adhesive tapes in the electronic industry and the like.

Description

technical field [0001] The invention relates to the field of adhesive tapes, in particular to a high-temperature-resistant release adhesive tape, a preparation method and an application thereof. Background technique [0002] Traditional OPP tapes cannot withstand the operating temperature of 150°C due to the limited base material. Generally, manufacturers use PET or PI (polyimide) tapes. These two tapes have no release function, and need to soak the release agent again, which will increase the production cost virtually. [0003] In the inflation molding of composite materials, the foam material (EPS) can be impregnated with latex, which has the advantages of easy shaping, impact resistance, and strong plasticity, but it also has disadvantages such as difficult demoulding and difficult peeling of core material residues. In order to solve the problem of difficult demoulding, current manufacturers usually attach a layer of high-temperature-resistant tape to the surface of the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/02C09J183/04C09J163/00C09J161/06C08L77/02C08L77/06B32B38/18
Inventor 刘烈新吴振宇钱开军
Owner 厦门新旺新材料科技有限公司
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