Synthetic fiber paper for highly heat-resistant circuit board with negative thermal expansion coefficient and preparation method and application

A negative thermal expansion coefficient and synthetic fiber technology, which is applied in the direction of synthetic cellulose/non-cellulose material pulp/paper, textiles and papermaking, and fiber raw material processing, can solve problems that have not been seen before, and achieve improved papermaking performance and cost improvement. Paper performance, the effect of ensuring uniformity

Inactive Publication Date: 2015-06-03
深圳昊天龙邦复合材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The synthetic fiber papers currently reported as circuit boards are mainly composed of high heat-resistant and high-modulus fibers as structural fibers, and high-temperature-resistant meta-aramid fibrid fibers or resins as binders. Fibers with negative values ​​are used as structural fibers

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0060] Example 1, preparation of synthetic fiber paper for circuit boards with negative thermal expansion coefficient and high heat resistance

[0061] Prepare the synthetic fiber paper of present embodiment 1 by following weight percentage:

[0062] PBO fiber (4 ~ 8mm) 70%

[0063] Aramid 1414 precipitated fiber 30%

[0064] The structural fibers and bonding fibers are sheeted into shape by wet papermaking, and the synthetic fiber paper is made into the synthetic fiber paper through high temperature and high pressure hot rolling. Pulp A is made by deflaking in a hydraulic deflaking machine; in addition, the aramid 1414 precipitated fiber is decomposed in a hydropulper at a concentration of 2% by weight, and is beaten through a mill to control the beating degree to about 70°SR to make pulp B. Mix slurry A and slurry B uniformly in the batching tank to form papermaking pulp that can be added to the headbox of the papermaking wire, add polyethylene oxide to the pulp stabilizat...

Embodiment 2

[0069] Example 2, preparation of synthetic fiber paper for circuit boards with negative thermal expansion coefficient and high heat resistance

[0070] Prepare the synthetic fiber paper of present embodiment 2 by following weight percentage:

[0071] PBO fiber (4 ~ 8mm) 30%

[0072] Aramid 1414 precipitated fiber 70%

[0073] The preparation method of corresponding synthetic fiber paper is identical with embodiment 1, can prepare synthetic fiber paper, and its corresponding test result is shown in Table 2:

[0074] Table 2 Properties of synthetic fiber paper

[0075] project unit Test Results Quantitative g / m 2 33.10 thickness mm 0.047 tightness g / cm3 0.70 tensile strength KN / m MD 1.53 Elongation %MD 2.11 Thermal expansion coefficient ppm / °C ‐4 thermal decomposition temperature ℃ 435

[0076] It can be seen from Table 2 that compared with Embodiment 1, the thermal expansion coefficient of the synthetic...

Embodiment 3

[0077] Example 3, preparation of synthetic fiber paper for circuit boards with negative thermal expansion coefficient and high heat resistance

[0078] Prepare the synthetic fiber paper of present embodiment 3 by following weight percentage:

[0079] PBO fiber (5 ~ 6mm) 70%

[0080] Aramid 1414 pulp 30%

[0081] The preparation method of corresponding fiber paper is identical with embodiment 1, promptly prepares synthetic fiber paper, and its corresponding test result is shown in Table 3:

[0082] Table 3 Physical and mechanical properties of synthetic fiber paper

[0083] project unit Test Results Quantitative g / m 2 33.50 thickness mm 0.046 tightness g / cm3 0.73 tensile strength KN / m MD 0.65 Elongation %MD 0.83 Thermal expansion coefficient ppm / °C ‐5 thermal decomposition temperature ℃ 439

[0084] Compared with Embodiment 1, the strength of the synthetic fiber paper is slightly decreased, and the ther...

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Abstract

The invention relates to synthetic fiber paper for a highly heat-resistant circuit board with negative thermal expansion coefficient and a preparation method and application. The synthetic fiber paper is prepared from the following components in percentage by weight: 10-90% of structural fiber and the balance of viscose fibers, wherein the viscose fibers are fibers with negative thermal expansion coefficient and are selected from poly-p-phenylene terephthamide precipitation fibers and/or poly (p-phenylene terephthalamide) pulp. The preparation method comprises the following steps: preparing the structural fibers and viscose fibers into papermaking pulp; papermaking and moulding by a wet process; and hot-rolling and calendering to prepare the synthetic fiber paper. X-Y axis thermal expansion coefficient (CTE) in a plane of the synthetic fiber paper is negative and can offset CTE of thermosetting resin in a substrate of a printed circuit board, so that the printed circuit board is relatively stable and reliable, and the synthetic fiber paper can be applied to preparing a reinforcing material of the substrate of the printed circuit board.

Description

technical field [0001] The invention belongs to the field of fiber paper preparation, and in particular relates to a synthetic fiber paper for circuit boards with negative thermal expansion coefficient and high heat resistance, a preparation method and application thereof. Background technique [0002] A printed circuit board (PCB) is a printed board that forms point-to-point connections and printed components on a common substrate according to a predetermined design. Printed circuit board is an indispensable accessory in modern electronic equipment, and it is widely used in various fields such as communications, digital products, instruments, medical equipment, aerospace and military industries. [0003] PCB substrates are usually called copper clad laminates, which are impregnated with resin with reinforcing materials, covered with copper foil on one or both sides, and formed by hot pressing. Commonly used reinforcing materials are wood pulp paper, glass fiber cloth, synt...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): D21H13/26D21H13/20D21H15/10D21H17/35
Inventor 林德苗常小斌肖东华陶琳
Owner 深圳昊天龙邦复合材料有限公司
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