The invention discloses a high temperature resistant release
adhesive tape as well as a preparation method and the use of the
adhesive tape. The high temperature resistant release
adhesive tape is composed of a release layer, a substrate and an adhesive layer, wherein the release layer and the adhesive layer are formed on the substrate in a
coating or spray-
coating manner; the substrate is a thin film prepared from the mixed material of PA6 and PA66, or PA6, or PA66 as a major material. The preparation method comprises the following steps: firstly, preparing the substrate from the mixed material of PA6 and PA66, or PA6, or PA66 as the major material; secondly, treating the thin film by use of a
corona treater to reduce the
surface energy; thirdly, forming the release layer and the adhesive layer on the corresponding release surface and adhesive surface of the thin film in a
coating or spray-coating manner respectively; and finally, slitting and
curling, and packaging to obtain a finished product. The high temperature resistant release adhesive tape is low in cost, and capable of bearing the use temperature within the range of 150 to 220 DEG C without melting,
embrittlement, breakage and the like. The high temperature resistant release adhesive tape can be widely applied to composite materials, and to the fields of bicycle frame five-way part wrapping, the difficult corner mold stripping parts of other
pipe fittings, vacuum-pumping process sealing adhesive tapes in the
electronic industry and the like.